参数资料
型号: SAK-XC2237M-104F40L
厂商: Infineon Technologies
文件页数: 8/107页
文件大小: 0K
描述: IC MCU 16BIT 320KB FLASH 64LQFP
标准包装: 1,900
系列: XC22xxM
核心处理器: C166SV2
芯体尺寸: 16/32-位
速度: 40MHz
连通性: CAN,EBI/EMI,I²C,LIN,SPI,SSC,UART/USART,USI
外围设备: I²S,POR,PWM,WDT
输入/输出数: 38
程序存储器容量: 832KB(832K x 8)
程序存储器类型: 闪存
RAM 容量: 50K x 8
电压 - 电源 (Vcc/Vdd): 3 V ~ 5.5 V
数据转换器: A/D 9x10b
振荡器型: 内部
工作温度: -40°C ~ 125°C
封装/外壳: 64-LQFP
包装: 带卷 (TR)
其它名称: SP000720382
XC2238M, XC2237M
XC2000 Family / Base Line
Package and Reliability
Data Sheet
105
V2.1, 2011-07
5.2
Thermal Considerations
When operating the XC223xM in a system, the total heat generated in the chip must be
dissipated to the ambient environment to prevent overheating and the resulting thermal
damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance
RΘJA” quantifies these parameters. The
power dissipation must be limited so that the average junction temperature does not
exceed 125 °C.
The difference between junction temperature and ambient temperature is determined by
ΔT = (P
INT + PIOSTAT + PIODYN) × R
ΘJA
The internal power consumption is defined as
P
INT = VDDP × IDDP (switching current and leakage current).
The static external power consumption caused by the output drivers is defined as
P
IOSTAT = Σ((VDDP-VOH) × IOH) + Σ(VOL × IOL)
The dynamic external power consumption caused by the output drivers (
P
IODYN) depends
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
Reduce
V
DDP, if possible in the system
Reduce the system frequency
Reduce the number of output pins
Reduce the load on active output drivers
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