参数资料
型号: SI7997DP-T1-GE3
厂商: Vishay Siliconix
文件页数: 1/9页
文件大小: 0K
描述: MOSFET P-CH 30V 8-SOIC
标准包装: 1
系列: TrenchFET®
FET 型: 2 个 P 沟道(双)
FET 特点: 标准
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 60A
开态Rds(最大)@ Id, Vgs @ 25° C: 5.5 毫欧 @ 20A,10V
Id 时的 Vgs(th)(最大): 2.2V @ 250µA
闸电荷(Qg) @ Vgs: 160nC @ 10V
输入电容 (Ciss) @ Vds: 6200pF @ 15V
功率 - 最大: 46W
安装类型: 表面贴装
封装/外壳: PowerPAK? SO-8 双
供应商设备封装: PowerPAK? SO-8 Dual
包装: 标准包装
其它名称: SI7997DP-T1-GE3DKR
New Product
Si7997DP
Vishay Siliconix
Dual P-Channel 30 V (D-S) MOSFET
PRODUCT SUMMARY
V DS (V) R DS(on) ( ? )
I D (A) a
Q g (Typ.)
FEATURES
? Halogen-free According to IEC 61249-2-21
Definition
- 30
0.0055 at V GS = - 10 V
0.0078 at V GS = - 4.5 V
PowerPAK ? SO-8
- 60
- 60
51 nC
? TrenchFET ? Power MOSFET
? PWM Optimized
? 100 % R g Tested
? 100 % UIS Tested
? Compliant to RoHS Directive 2002/95/EC
6.15 mm
1
S1
2
G1
3
S2
5.15 mm
G2
APPLICATIONS
? Battery and Load Switching
for Notebook PCs
S 1
S 2
4
8
D1
7
D1
6
D2
5
D2
G 1
G 2
Bottom V ie w
D 1
D 2
Orderin g Information: Si7997DP-T1-GE3 (Lead (P b )-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS (T A = 25 °C, unless otherwise noted)
P-Channel MOSFET P-Channel MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
T C = 25 °C
Symbol
V DS
V GS
Limit
- 30
± 20
- 60 a
Unit
V
Continuous Drain Current (T J = 150 °C)
T C = 70 °C
T A = 25 °C
I D
- 60 a
- 20.8 b, c
Pulsed Drain Current
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
T A = 70 °C
T C = 25 °C
T A = 25 °C
L = 0.1 mH
I DM
I S
I AS
E AS
- 16.6 b, c
- 100
- 38
- 2.9 b, c
- 30
45
A
mJ
T C = 25 °C
46
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
29
3.5 b, c
W
T A = 70 °C
2.2 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient
b, f
Maximum Junction-to-Case (Drain)
t ? 10 s
Steady State
R thJA
R thJC
26
2.2
35
2.7
°C/W
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile ( www.vishay.com/ppg?73257 ). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 85 °C/W.
Document Number: 66719
S10-1826-Rev. A, 09-Aug-10
www.vishay.com
1
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