参数资料
型号: SI8405DB-T1-E3
厂商: Vishay Siliconix
文件页数: 1/9页
文件大小: 0K
描述: MOSFET P-CH 12V 3.6A 2X2 4-MFP
标准包装: 3,000
系列: TrenchFET®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 12V
电流 - 连续漏极(Id) @ 25° C: 3.6A
开态Rds(最大)@ Id, Vgs @ 25° C: 55 毫欧 @ 1A,4.5V
Id 时的 Vgs(th)(最大): 950mV @ 250µA
闸电荷(Qg) @ Vgs: 21nC @ 4.5V
功率 - 最大: 1.47W
安装类型: 表面贴装
封装/外壳: 4-XFBGA,CSPBGA
供应商设备封装: 4-Microfoot
包装: 带卷 (TR)
Si8405DB
Vishay Siliconix
12 V P-Channel 1.8 V (G-S) MOSFET
FEATURES
PRODUCT SUMMARY
? TrenchFET ? Power MOSFET
V DS (V)
- 12
R DS(on) ( ? )
0.055 at V GS = - 4.5 V
0.070 at V GS = - 2.5 V
0.090 at V GS = - 1.8 V
I D (A)
- 4.9
- 4.4
-4
? MICRO FOOT ? Chipscale Packaging
Reduces Footprint Area Profile (0.62 mm) and
On-Resistance Per Footprint Area
? Material categorization:
For definitions of compliance please see
MICRO FOOT
www.vishay.com/doc?99912
Bump Side View
Backside View
APPLICATIONS
3
2
? PA, Battery and Load Switch
S
D
D
8405
xxx
? Battery Charger Switch
G
4
S
G
1
Device Marking: 8405
xxx = Date/Lot Traceability Code
Ordering Information: Si8405DB-T1-E1 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS (T A = 25 °C, unless otherwise noted)
D
P-Channel MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
Symbol
V DS
V GS
5s
Steady State
- 12
±8
Unit
V
Continuous Drain Current (T J = 150 °C) a
Pulsed Drain Current
T A = 25 °C
T A = 70 °C
I D
I DM
- 4.9
- 3.9
- 10
- 3.6
- 2.8
A
Continuous Source Current (Diode Conduction) a
I S
- 2.5
- 1.3
Maximum Power Dissipation a
Operating Junction and Storage Temperature Range
Package Reflow Conditions b
T A = 25 °C
T A = 70 °C
IR/Convection
P D
T J , T stg
2.77
1.77
- 55 to 150
260
1.47
0.94
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient a
Maximum Junction-to-Foot (drain)
t ? 5s
Steady State
Steady State
R thJA
R thJF
35
72
16
45
85
20
°C/W
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. Refer to IPC/JEDEC (J-STD-020), no manual or hand soldering.
c. In this document, any reference to case represents the body of the MICRO FOOT device and foot is the bump.
Document Number: 71814
S13-1847-Rev. F, 19-Aug-13
For technical questions, contact: pmostechsupport@vishay.com
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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