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| 型号： | SIB457EDK-T1-GE3 |
| 厂商： | Vishay Siliconix |
| 文件页数： | 1/9页 |
| 文件大小： | 0K |
| 描述： | MOSFET P-CH D-S 20V PPAK SC75-6L |
| 标准包装： | 3,000 |
| 系列： | TrenchFET® |
| FET 型： | MOSFET P 通道，金属氧化物 |
| FET 特点： | 逻辑电平门 |
| 漏极至源极电压(Vdss)： | 20V |
| 电流 - 连续漏极(Id) @ 25° C： | 9A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 35 毫欧 @ 4.8A，4.5V |
| Id 时的 Vgs(th)（最大）： | 1V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 44nC @ 8V |
| 功率 - 最大： | 13W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | PowerPAK? SC-75-6L |
| 供应商设备封装： | PowerPAK? SC-75-6L 单 |
| 包装： | 带卷 (TR) |
SiB457EDK
Vishay Siliconix
P-Channel 20 V (D-S) MOSFET
PRODUCT SUMMARY
V DS (V) R DS(on) ( ? )
0.035 at V GS = - 4.5 V
I D (A)
- 9 a
Q g (Typ.)
FEATURES
? Halogen-free According to IEC 61249-2-21
Definition
? TrenchFET ? Power MOSFET
- 20
0.049 at V GS = - 2.5 V
0.079 at V GS = - 1.8 V
0.157 at V GS = - 1.5 V
- 9 a
- 9 a
-2
13 nC
? New Thermally Enhanced PowerPAK ?
SC-75 Package
- Small Footprint Area
- Low On-Resistance
? 100 % R g Tested
PowerPAK SC-75-6L-Sin g le
1
? Typical ESD Performance: 2500 V
? Built in ESD Protection with Zener Diode
? Compliant to RoHS Directive 2011/65/EU
D
2
APPLICATIONS
6
D
5
D
S
D
G
3
? Load Switch for Portable Devices
? Load Switch for Charging Circuits
Markin g Code
S
1.60 mm
4
S
1.60 mm
BJX
Orderin g Information:
SiB457EDK-T1-GE3 (Lead (P b )-free and Halogen-free)
Part # code
XXX
Lot Tracea b ility
and Date code
G
R
ABSOLUTE MAXIMUM RATINGS (T A = 25 °C, unless otherwise noted)
P-Channel MOSFET
D
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T J = 150 °C)
Pulsed Drain Current
Continuous Source-Drain Diode Current
T C = 25 °C
T C = 70 °C
T A = 25 °C
T A = 70 °C
T C = 25 °C
T A = 25 °C
V DS
V GS
I D
I DM
I S
- 20
±8
- 9 a
- 9 a
- 6.8 b, c
- 5.5 b, c
- 25
- 9 a
- 2 b, c
V
A
T C = 25 °C
13
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
T C = 70 °C
T A = 25 °C
T A = 70 °C
P D
T J , T stg
8.4
2.4 b, c
1.6 b, c
- 55 to 150
260
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient
b, f
Maximum Junction-to-Case (Drain)
t ? 5s
Steady State
R thJA
R thJC
41
7.5
51
9.5
°C/W
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile ( www.vishay.com/doc?73257 ). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 105 °C/W.
Document Number: 64816
S12-0497-Rev. C, 05-Mar-12
For more information please contact: pmostechsupport@vishay.com
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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