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参数资料
| 型号： | SME5434PCI-480 |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 64-BIT, 480 MHz, RISC PROCESSOR, XMA |
| 封装： | 130 X 100 MM, 45 MM HEIGHT MODULE |
| 文件页数： | 7/34页 |
| 文件大小： | 418K |
| 代理商： | SME5434PCI-480 |
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15
360/440/480MHz CPU; 0.25 to 2 MB L2 cache, UPA64S, 66MHz PCI
UltraSPARC-IIi CPU Module
March 1999
Sun Microsystems, Inc
SME5431PCI-360
SME5434PCI-440
SME5434PCI-480
Preliminary
SPECIFICATIONS
Absolute Maximum Ratings [1] [2]
1. Operation of the device at values exceeding those listed may result in degradation or destruction of the device. Functional operation of the device
at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. Unless otherwise noted, all voltages are with respect to VSS.
Symbol
Parameter
Conditions
Rating
Unit
VDD
Supply voltage range for I/O
–
0 to 3.8
V
VDD_CORE
Supply voltage range for CPU core
–
0 to 2.2 [3]
3. VDD_CORE voltage must be lower than VDD except for power cycling when VDD can be lower than VDD_CORE for 30 ms or less when the current is
limited to twice the maximum rating for the CPU.
V
VI
Input voltage range
–
Vss - 0.5 < VI < VDD +0.5
V
VO
Output voltage range
–
Vss - 0.5 < VO < VDD +0.5
V
IIK
Input clamp current
VI < 0 - 0.5V or VI > VDD + 0.5V
20
mA
IOK
Output clamp current
VI < 0 - 0.5V or VI > VDD + 0.5V
±50
mA
IOL
Current into any output in the low
state
–50
mA
–
Shock [4]
4. These specications are for the module assembly alone and do not apply to the module connectors when installed in a system board. Sun uses
an attachment device for the module in such an installation.
in any axis
15
g
–
Vibration [4]
peak value in any axis and within
spectral range 5
≤ f ≤ 500 Hz
0.25
g
Recommended Operating Conditions [1]
1. For storage specications, see "Storage and Shipping Environmental Specications" on page 30
Symbol
Parameter
Condition
Min
Typ
Max
Unit
VDD
Supply voltage for I/O
–
3.14
3.3
3.46
V
VDD_CORE Supply voltage for the CPU
core
–
1.84
1.90
1.96
V
IOH
High-level output current
–
-4.0
mA
IOL
Low-level output current
–
8.0
mA
TJ
Operating junction
temperature [2]
2. Junction temperature can be calculated based upon heat sink or case-temperature measurements; see page 21.
––
–
85
°C
TA
Operating ambient
temperature
–
0
–
see
notes [3]
3. Maximum allowable ambient temperature depends upon air ow rate and must be chosen so that the maximum junction temperature TJ is not
exceeded. See "Thermal Considerations" on page 21.
°C
–
Airow through heatsink
(360 MHz, 440 MHz, and
480 MHz CPU)
inlet at 30
°C and sea-level altitude
–
150
ft./min
inlet at 45
°C and 10,000 ft. altitude [4]
4. The increased air ow accounts for a 25% increased heatsink-to-air thermal resistance,
θ
Si, for 10,000ft altitude and higher air temperature.
Always measure operating temperature to validate airow design.
–
300
ft./min
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