参数资料
型号: SPC560B50L3-ENG
厂商: STMICROELECTRONICS
元件分类: 微控制器/微处理器
英文描述: 32-BIT, FLASH, 64 MHz, MICROCONTROLLER, PQFP100
封装: 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, LQFP-100
文件页数: 6/113页
文件大小: 983K
代理商: SPC560B50L3-ENG
SPC560Bx, SPC560Cx
Package characteristics
Doc ID 14619 Rev 7
103/113
D
16.80
17.00
17.20
0.6614
0.6693
0.6772
D1
15.00
0.5906
E
16.80
17.00
17.20
0.6614
0.6693
0.6772
E1
15.00
0.5906
e
1.00
0.0394
F
1.00
0.0394
ddd
0.20
0.0079
eee
0.25
0.0098
(4)
fff
0.10
0.0039
(5)
1.
Values in inches are converted from mm and rounded to four decimal digits.
2.
LBGA stands for
Low profile Ball Grid Array.
— Low profile: The total profile height (Dim A) is measured from the seating plane to the top of the
component
— The maximum total package height is calculated by the following methodology:
A2 Typ+A1 Typ +
(A12+A32+A42 tolerance values)
— Low profile: 1.20 mm < A < 1.70 mm
3.
The typical ball diameter before mounting is 0.60 mm.
4.
The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.
For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true
position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball
must lie within this tolerance zone.
5.
The tolerance of position that controls the location of the balls within the matrix with respect to each other.
For each ball there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position
as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone.
Each tolerance zone fff in the array is contained entirely in the respective zone eee above.
The axis of each ball must lie simultaneously in both tolerance zones.
Table 49.
LBGA208 mechanical data (continued)
Symbol
mm
inches(1)
Notes
Min
Typ
Max
Min
Typ
Max
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