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Electrical characteristics
SPC560Bx, SPC560Cx
Doc ID 14619 Rev 7
4.11
Flash memory electrical characteristics
4.11.1
Program/Erase characteristics
Table 25 shows the program and erase characteristics.
IDDSTDBY2 CC
P
STANDBY2 mode
current(9)
Slow internal RC
oscillator (128 kHz)
running
TA = 25 °C
—
30
100
A
DTA =55 °C
—
75
—
DTA = 85 °C
—
180
—
DTA = 105 °C
—
315
—
PTA = 125 °C
—
560
1700
IDDSTDBY1 CC
T
STANDBY1 mode
current(10)
Slow internal RC
oscillator (128 kHz)
running
TA =25 °C
—
20
60
A
DTA =55 °C
—
45
—
DTA = 85 °C
—
100
—
DTA = 105 °C
—
165
—
DTA = 125 °C
—
280
900
1.
VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C, unless otherwise specified
2.
Running consumption is given on voltage regulator supply (VDDREG). IDDMAX is composed of three components: IDDMAX =
IDD(vdd_bv) + IDD(vdd_hv) + IDD(Vdd_hv_adc). It does not include a fourth component linked to I/Os toggling which is
highly dependent on the application. The given value is thought to be a worst case value with all peripherals running, and
code fetched from code flash while modify operation on-going on data flash. It is to be noticed that this value can be
significantly reduced by application: switch-off not used peripherals (default), reduce peripheral frequency through internal
prescaler, fetch from RAM most used functions, use low power mode when possible.
3.
Higher current may be sinked by device during power-up and standby exit. please refer to in rush current on
Table 22.
4.
RUN current measured with typical application with accesses on both flash and RAM.
5.
Only for the “P” classification: Data and Code Flash in Normal Power. Code fetched from RAM: Serial IPs CAN and LIN in
loop back mode, DSPi as Master, PLL as system Clock (4 x Multiplier) peripherals on (eMIOS/CTU/ADC) and running at
max frequency, periodic SW/WDG timer reset enabled.
6.
Data Flash Power Down. Code Flash in Low Power. RC-osc128kHz & RC-OSC 16MHz on. 10MHz XTAL clock. FlexCAN:
instances: 0, 1, 2 ON (clocked but not reception or transmission), instances: 4, 5, 6 clock gated. LINFlex: instances: 0, 1, 2
ON (clocked but not reception or transmission), instance: 3 clock gated. eMIOS: instance: 0 ON (16 channels on PA[0]-
PA[11] and PC[12]-PC[15]) with PWM 20kHz, instance: 1 clock gated. DSPI: instance: 0 (clocked but no communication).
RTC/API ON.PIT ON. STM ON. ADC ON but not conversion except 2 analogue watchdog
7.
Only for the “P” classification: No clock, RC 16MHz off, RC128kHz on, PLL off, HPvreg off, ULPVreg/LPVreg on. All
possible peripherals off and clock gated. Flash in power down mode.
8.
When going from RUN to STOP mode and the core consumption is > 6 mA , it is normal operation for the main regulator
module to be kept on by the on-chip current monitoring circuit. This is most likely to occur with junction temperatures
exceeding 125 °C and under these circumstances , it is possible for the current to initially exceed the maximum STOP
specification by up to 2 mA. After entering stop, the application junction temperature will reduce to the ambient level and
the main regulator will be automatically switched off when the load current is below 6 mA.
9.
Only for the “P” classification: ULPreg on, HP/LPVreg off, 32kB RAM on, device configured for minimum consumption, all
possible modules switched-off.
10. ULPreg on, HP/LPVreg off, 8kB RAM on, device configured for minimum consumption, all possible modules switched-off.
Table 24.
Low voltage power domain electrical characteristics (continued)
Symbol
C
Parameter
Conditions(1)
Value
Unit
Min
Typ
Max