参数资料
型号: SST29LE512-150-4I-EHE
厂商: SILICON STORAGE TECHNOLOGY INC
元件分类: PROM
英文描述: 64K X 8 FLASH 3V PROM, 150 ns, PDSO32
封装: 8 X 20 MM, MO-142BD, TSOP1-32
文件页数: 12/28页
文件大小: 348K
代理商: SST29LE512-150-4I-EHE
2
Data Sheet
512 Kbit Page-Write EEPROM
SST29EE512 / SST29LE512 / SST29VE512
2003 Silicon Storage Technology, Inc.
S71060-08-000
11/03 301
Read
The Read operations of the SST29EE/LE/VE512 are con-
trolled by CE# and OE#, both have to be low for the system
to obtain data from the outputs. CE# is used for device
selection. When CE# is high, the chip is deselected and
only standby power is consumed. OE# is the output control
and is used to gate data from the output pins. The data bus
is in high impedance state when either CE# or OE# is high.
Refer to the Read cycle timing diagram for further details
Write
The Page-Write to the SST29EE/LE/VE512 should always
use the JEDEC Standard Software Data Protection (SDP)
three-byte command sequence. The SST29EE/LE/VE512
contain the optional JEDEC approved Software Data Pro-
tection scheme. SST recommends that SDP always be
enabled, thus, the description of the Write operations will
be given using the SDP enabled format. The three-byte
SDP Enable and SDP Write commands are identical;
therefore, any time a SDP Write command is issued,
Software Data Protection is automatically assured. The
first time the three-byte SDP command is given, the device
becomes SDP enabled. Subsequent issuance of the same
command bypasses the data protection for the page being
written. At the end of the desired Page-Write, the entire
device remains protected. For additional descriptions,
please see the application notes
The Proper Use of
JEDEC Standard Software Data Protection and Protecting
Against Unintentional Writes When Using Single Power
Supply Flash Memories.
The Write operation consists of three steps. Step 1 is the
three-byte load sequence for Software Data Protection.
Step 2 is the byte-load cycle to a page buffer of the
SST29EE/LE/VE512. Steps 1 and 2 use the same timing
for both operations. Step 3 is an internally controlled Write
cycle for writing the data loaded in the page buffer into the
memory array for nonvolatile storage. During both the SDP
three-byte load sequence and the byte-load cycle, the
addresses are latched by the falling edge of either CE# or
WE#, whichever occurs last. The data is latched by the ris-
ing edge of either CE# or WE#, whichever occurs first. The
internal Write cycle is initiated by the TBLCO timer after the
rising edge of WE# or CE#, whichever occurs first. The
Write cycle, once initiated, will continue to completion, typi-
cally within 5 ms. See Figures 5 and 6 for WE# and CE#
controlled Page-Write cycle timing diagrams and Figures
15 and 17 for flowcharts.
The Write operation has three functional cycles: the Soft-
ware Data Protection load sequence, the page-load cycle,
and the internal Write cycle. The Software Data Protection
consists of a specific three-byte load sequence that allows
writing to the selected page and will leave the SST29EE/
LE/VE512 protected at the end of the Page-Write. The
page-load cycle consists of loading 1 to 128 Bytes of data
into the page buffer. The internal Write cycle consists of the
TBLCO time-out and the write timer operation. During the
Write operation, the only valid reads are Data# Polling and
Toggle Bit.
The Page-Write operation allows the loading of up to 128
Bytes of data into the page buffer of the SST29EE/LE/
VE512 before the initiation of the internal Write cycle. Dur-
ing the internal Write cycle, all the data in the page buffer is
written simultaneously into the memory array. Hence, the
Page-Write feature of SST29EE/LE/VE512 allows the
entire memory to be written in as little as 2.5 seconds. Dur-
ing the internal Write cycle, the host is free to perform addi-
tional tasks, such as to fetch data from other locations in
the system to set up the write to the next page. In each
Page-Write operation, all the bytes that are loaded into the
page buffer must have the same page address, i.e. A7
through A16. Any byte not loaded with user data will be writ-
ten to FFH.
See Figures 5 and 6 for the Page-Write cycle timing dia-
grams. If after the completion of the three-byte SDP load
sequence or the initial byte-load cycle, the host loads a sec-
ond byte into the page buffer within a byte-load cycle time
(TBLC) of 100 s, the SST29EE/LE/VE512 will stay in the
page-load cycle. Additional bytes are then loaded consecu-
tively. The page-load cycle will be terminated if no addi-
tional byte is loaded into the page buffer within 200 s
(TBLCO) from the last byte-load cycle, i.e., no subsequent
WE# or CE# high-to-low transition after the last rising edge
of WE# or CE#. Data in the page buffer can be changed by
a subsequent byte-load cycle. The page-load period can
continue indefinitely, as long as the host continues to load
the device within the byte-load cycle time of 100 s. The
page to be loaded is determined by the page address of
the last byte loaded.
Software Chip-Erase
The SST29EE/LE/VE512 provide a Chip-Erase operation,
which allows the user to simultaneously clear the entire
memory array to the “1” state. This is useful when the entire
device must be quickly erased.
The Software Chip-Erase operation is initiated by using a
specific six-byte load sequence. After the load sequence,
the device enters into an internally timed cycle similar to the
Write cycle. During the Erase operation, the only valid read
is Toggle Bit. See Table 4 for the load sequence, Figure 10
for timing diagram, and Figure 19 for the flowchart.
相关PDF资料
PDF描述
SST38VF6401-90-4I-EKE 4M X 16 FLASH 2.7V PROM, 90 ns, PDSO48
SST49LF003B-33-4C-NH 384K X 8 FLASH 3V PROM, 11 ns, PQCC32
SSTAR-01 SPECIALTY TELECOM CIRCUIT
SSTV16857MTDX
SSTV16857MTDX_NL
相关代理商/技术参数
参数描述
SST29LE512-150-4I-NH 功能描述:闪存 64K X 8 150ns RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
SST29LE512-150-4I-NHE 功能描述:闪存 64K X 8 150ns RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
SST29LE512-150-4I-PH 制造商:SST 制造商全称:Silicon Storage Technology, Inc 功能描述:512 Kbit (64K x8) Page-Mode EEPROM
SST29LE512-150-4I-UH 制造商:SST 制造商全称:Silicon Storage Technology, Inc 功能描述:512 Kbit (64K x8) Page-Mode EEPROM
SST29LE512-150-4I-WH 制造商:SST 制造商全称:Silicon Storage Technology, Inc 功能描述:512 Kbit (64K x8) Page-Mode EEPROM