参数资料
型号: STEL-1177/CF
厂商: INTEL CORP
元件分类: 数字信号处理外设
英文描述: 8-BIT, DSP-NUM CONTROLLED OSCILLATOR, CPGA84
封装: CERAMIC, PGA-84
文件页数: 11/17页
文件大小: 224K
代理商: STEL-1177/CF
3
STEL-1177
1. Plastic (PLCC) (/CM) or Ceramic (CLDCC) (/CC and /MC) Leaded Chip Carrier
0.200"
max.
1.190"
± 0.005"
33333334444 4444445555
34567890123 4567890123
1 1
8888877777
10987654321432 1098765
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
0.145"
max.
0.017"
± 0.004" (2)
0.018"
0.035"
nominal
1.150"
± 0.012"
1 1
8 888 87 777 7
10 98 765 432 14 321 09 876 5
74
73
333 33 334 44 44 444 44 55 55
345 67 890 12 34 567 89 01 23
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
1.154"
± 0.004"
0.05"
nominal (1)
0.05"
± 0.005" (1)
Top View
Package:
84 pin CLDCC
Thermal coefficient, qja = 34
°/W
Package:
84 pin PLCC
Thermal coefficient, qja = 30
°/W
Notes:
1.
Dimensions shown are for plastic package.
Dimensions for ceramic package are similar.
2.
Tolerances on pin spacing are not cumulative.
2. Ceramic Pin Grid Array (CPGA) (/CF and /MF)
Notes: 1.
Tolerances on pin spacings are not
cumulative.
2.
Corner pins have integral standoffs
which raise the package 0.07" (nominal)
above the mounting surface.
3.
Orientation determined by extra pin at
location C3.
4.
Thermal coefficient,
θ
ja = 28°C/watt
PIN
CONFIGURATION
L
K
J
H
G
F
E
D
C
B
A
123456789 1011
1.10" ± .02 "sq..
0.1"
± .005"
0.117"
max.
0.18"
± .005"
0.018"
± .001" dia.
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