SWCS037G
– MAY 2008 – REVISED APRIL 2011
11.1
Clock Features
.............................................................................................................
8311.2
Input Clock Specifications
................................................................................................
8411.2.1
Clock Source Requirements
..................................................................................
8411.2.2
HFCLKIN
.........................................................................................................
8411.2.3
32-kHz Input Clock
.............................................................................................
8611.2.3.1
External Crystal Description
......................................................................
8711.2.3.2
External Clock Description
........................................................................
8811.3
Output Clock Specifications
..............................................................................................
9111.3.1
32KCLKOUT Output Clock
....................................................................................
9111.3.2
HFCLKOUT Output Clock
.....................................................................................
9211.3.3
Output Clock Stabilization Time
..............................................................................
9312
Timing Requirements and Switching Characteristics
............................................................. 94 12.1
Timing Parameters
........................................................................................................
9412.2
Target Frequencies
........................................................................................................
9512.3
I
2C Timing
..................................................................................................................
9612.4
Audio Interface: TDM/I2S Protocol
......................................................................................
9712.4.1
I2S Right- and Left-Justified Data Format
...................................................................
9812.4.2
TDM Data Format
.............................................................................................
10012.5
JTAG Interfaces
..........................................................................................................
10113
Debouncing Time
............................................................................................................. 103 14
External Components
....................................................................................................... 104 15
TPS65920/TPS65930 Package
............................................................................................ 107 15.1
TPS65920/TPS65930 Standard Package Symbols
.................................................................
10715.2
Package Thermal Resistance Characteristics
.......................................................................
10715.3
Mechanical Data
.........................................................................................................
10815.4
ESD Specifications
......................................................................................................
10916
Glossary
......................................................................................................................... 110 4
Contents
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2008–2011, Texas Instruments Incorporated