参数资料
型号: W25Q16CVSSIG
厂商: Winbond Electronics
文件页数: 70/81页
文件大小: 0K
描述: IC SPI FLASH 16MBIT 8SOIC
标准包装: 90
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 16M(2M x 8)
速度: 104MHz
接口: SPI 串行
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.209",5.30mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
W25Q16CV
9.3
8-Pin SOIC 208-mil (Package Code SS)
GAUGE PLANE
SYMBOL
A
A1
A2
b
C
D
D1
E
E1
Min
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
MILLIMETERS
Nom
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
Max
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
Min
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
INCHES
Nom
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
Max
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
e
(2)
1.27 BSC.
0.050 BSC.
H
L
y
θ
7.70
0.50
---
7.90
0.65
---
---
8.10
0.80
0.10
0.303
0.020
---
0.311
0.026
---
---
0.319
0.031
0.004
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
- 70 -
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