参数资料
型号: W25Q32DWZPIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 256K X 16 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO8
封装: 6 X 5 MM, GREEN, WSON-8
文件页数: 52/82页
文件大小: 1155K
代理商: W25Q32DWZPIP
W25Q32DW
- 56 -
10.2.31 Read Manufacturer / Device ID Dual I/O (92h)
The Read Manufacturer / Device ID Dual I/O instruction is an alternative to the Read Manufacturer /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID
at 2x speed.
The Read Manufacturer / Device ID Dual I/O instruction is similar to the Fast Read Dual I/O instruction.
The instruction is initiated by driving the /CS pin low and shifting the instruction code “92h” followed by a
24-bit address (A23-A0) of 000000h, but with the capability to input the Address bits two bits per clock.
After which, the Manufacturer ID for Winbond (EFh) and the Device ID are shifted out 2 bits per clock on
the falling edge of CLK with most significant bits (MSB) first as shown in Figure 30. The Device ID values
for the W25Q32DW is listed in Manufacturer and Device Identification table. If the 24-bit address is
initially set to 000001h the Device ID will be read first and then followed by the Manufacturer ID. The
Manufacturer and Device IDs can be read continuously, alternating from one to the other. The instruction
is completed by driving /CS high.
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (92h)
High Impedance
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
7
5
3
1
*
6
4
2
0
7
5
3
1
6
4
2
0
7
5
3
1
6
4
2
0
7
5
3
1
6
4
2
0
23
*
A23-16
A15-8
A7-0 (00h)
M7-0
/CS
CLK
DI
(IO
0)
DO
(IO
1)
24
25
26
27
28
29
30
31
32
33
34
36
37
38
35
23
0
Mode 0
Mode 3
7
5
3
1
6
4
2
0
7
5
3
1
6
4
2
0
7
5
3
1
6
4
2
0
7
5
3
6
4
2
1
0
1
MFR ID
Device ID
MFR ID
(repeat)
Device ID
(repeat)
IOs switch from
Input to Output
*
= MSB
*
Figure 30. Read Manufacturer / Device ID Dual I/O Instruction (SPI Mode only)
Note:
The “Continuous Read Mode” bits M(7-0) must be set to Fxh to be compatible with Fast Read Dual I/O instruction.
相关PDF资料
PDF描述
W25Q80VZPIG 1M X 8 SPI BUS SERIAL EEPROM, DSO8
W25X16AVDAIZ 2M X 8 FLASH 2.7V PROM, PDIP8
W25X40AVSSIG 512K X 8 FLASH 2.7V PROM, PDSO8
W25X80AVDAIZ 1M X 8 FLASH 2.7V PROM, PDIP8
W25X80ALSSIG 1M X 8 FLASH 2.7V PROM, PDSO8
相关代理商/技术参数
参数描述
W25Q32FVSFIG 功能描述:IC FLASH SPI 32MBIT 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:4.5M(256K x 18) 速度:133MHz 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x20) 包装:托盘
W25Q32FVSSIG 制造商:Winbond Electronics Corp 功能描述:Flash Serial-SPI 3V/3.3V 32Mbit 4M x 8bit 8.5ns 8-Pin SOIC 制造商:Winbond Electronics Corp 功能描述:32MB F VERSIOB SPI FLASH 制造商:Winbond Electronics Corp 功能描述:IC FLASH 32MBIT 104MHZ 8SOIC
W25Q32FVSSIG TR 制造商:Winbond Electronics Corp 功能描述:IC FLASH 32MBIT 104MHZ 8SOIC
W25Q32FVSSIQ 制造商:Winbond Electronics Corp 功能描述:
W25Q32FVZPIG 功能描述:IC FLASH SPI 32MBIT 8WSON RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?(单线) 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽) 供应商设备封装:8-MSOP 包装:带卷 (TR)