参数资料
型号: W25Q32DWZPIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 256K X 16 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO8
封装: 6 X 5 MM, GREEN, WSON-8
文件页数: 55/82页
文件大小: 1155K
代理商: W25Q32DWZPIP
W25Q32DW
Publication Release Date: January 18, 2011
- 59 -
Preliminary - Revision C
10.2.34 Read JEDEC ID (9Fh)
For compatibility reasons, the W25Q32DW provides several instructions to electronically determine the
identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI
compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin
low and shifting the instruction code “9Fh”. The JEDEC assigned Manufacturer ID byte for Winbond (EFh)
and two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the
falling edge of CLK with most significant bit (MSB) first as shown in Figure 33a & 33b. For memory type
and capacity values refer to Manufacturer and Device Identification table.
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (9Fh)
High Impedance
8
9
10
12
13
14
15
Capacity ID7-0
/CS
CLK
DI
(IO
0)
DO
(IO
1)
16
17
18
19
20
21
22
23
Manufacturer ID (EFh)
24
25
26
28
29
30
7
6
5
4
3
2
1
0
*
27
15
Mode 0
Mode 3
11
7
6
5
4
3
2
1
0
*
Memory Type ID15-8
= MSB
*
Figure 33a. Read JEDEC ID Instruction (SPI Mode)
/CS
CLK
Mode 0
Mode 3
0
1
IO
0
IO
1
IO
2
IO
3
9Fh
2
3
4
5
12
8
13
9
14
10
15
11
EFh
6
4
0
5
1
6
2
7
3
ID15-8
ID7-0
IOs switch from
Input to Output
Instruction
Mode 0
Mode 3
Figure 33b. Read JEDEC ID Instruction (QPI Mode)
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