参数资料
型号: W25Q64DWSFIG
厂商: Winbond Electronics
文件页数: 67/82页
文件大小: 0K
描述: IC FLASH SPI 64MBIT 16SOIC
标准包装: 44
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 64M(8M x 8)
速度: 104MHz
接口: SPI 串行
电源电压: 1.7 V ~ 1.95 V
工作温度: -40°C ~ 85°C
封装/外壳: 16-SOIC(0.295",7.50mm 宽)
供应商设备封装: 16-SOIC
包装: 管件
W25Q64DW
10.2.42 Enable Reset (66h) and Reset (99h)
Because of the small package and the limitation on the number of pins, the W25Q64DW provide a
software Reset instruction instead of a dedicated RESET pin. Once the Reset instruction is accepted, any
on-going internal operations will be terminated and the device will return to its default power-on state and
lose all the current volatile settings, such as Volatile Status Register bits, Write Enable Latch (WEL)
status, Program/Erase Suspend status, Read parameter setting (P7-P0), Continuous Read Mode bit
setting (M7-M0) and Wrap Bit setting (W6-W4).
“Enable Reset (66h)” and “Reset (99h)” instructions can be issued in either SPI mode or QPI mode. To
avoid accidental reset, both instructions must be issued in sequence. Any other commands other than
“Reset (99h)” after the “Enable Reset (66h)” command will disable the “Reset Enable” state. A new
sequence of “Enable Reset (66h)” and “Reset (99h)” is needed to reset the device. Once the Reset
command is accepted by the device, the device will take approximately tRST=30us to reset. During this
period, no command will be accepted.
Data corruption may happen if there is an on-going or suspended internal Erase or Program operation
when Reset command sequence is accepted by the device. It is recommended to check the BUSY bit and
the SUS bit in Status Register before issuing the Reset command sequence.
/CS
Mode 3
0
1
2
3
4
5
6
7
Mode 3
0
1
2
3
4
5
6
7
Mode 3
CLK
Mode 0
Instruction (66h)
Mode 0
Instruction (99h)
Mode 0
DI
(IO 0 )
DO
High Impedance
(IO 1 )
Figure 41a. Enable Reset and Reset Instruction Sequence (SPI Mode)
/CS
Mode 3
0
1
Mode 3
0
1
Mode 3
CLK
Mode 0
I nstructio n
66h
Mode 0
In structio n
99h
Mode 0
IO 0
IO 1
IO 2
IO 3
Figure 41b. Enable Reset and Reset Instruction Sequence (QPI Mode)
Publication Release Date: September 18, 2012
- 67 -
Revision D
相关PDF资料
PDF描述
GBB105DHBT CONN EDGECARD 210PS R/A .050 SLD
GCB95DHBN CONN EDGECARD 190PS R/A .050 SLD
GCB95DHBD CONN EDGECARD 190PS R/A .050 SLD
EMM44DRAN CONN EDGECARD 88POS R/A .156 SLD
EMM44DRAH CONN EDGECARD 88POS R/A .156 SLD
相关代理商/技术参数
参数描述
W25Q64DWSFIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q64DWSSIG 功能描述:IC FLASH SPI 64MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?(单线) 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽) 供应商设备封装:8-MSOP 包装:带卷 (TR)
W25Q64DWSSIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q64DWZEIG 功能描述:IC FLASH SPI 64MBIT 8WSON RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:4.5M(256K x 18) 速度:133MHz 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x20) 包装:托盘
W25Q64DWZEIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI