参数资料
型号: W25Q80BLDAIG
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 8M X 1 SPI BUS SERIAL EEPROM, PDIP8
封装: 0.300 INCH, GREEN, PLASTIC, DIP-8
文件页数: 68/75页
文件大小: 2267K
代理商: W25Q80BLDAIG
W25Q80BL
- 70 -
11.3 8-Pin PDIP 300-mil (Package Code DA)
MILLIMETERS
INCHES
SYMBOL
Min
Nom
Max
Min
Nom
Max
A
---
5.33
---
0.210
A1
0.38
---
0.015
---
A2
3.18
3.30
3.43
0.125
0.130
0.135
D
9.02
9.27
10.16
0.355
0.365
0.400
E
7.62 BSC.
0.300 BSC.
E1
6.22
6.35
6.48
0.245
0.250
0.255
L
2.92
3.30
3.81
0.115
0.130
0.150
eB
8.51
9.02
9.53
0.335
0.355
0.375
θ°
15°
15°
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相关代理商/技术参数
参数描述
W25Q80BLDAIP 制造商:WINBOND 制造商全称:Winbond 功能描述:2.5V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
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W25Q80BLSNIP 制造商:WINBOND 制造商全称:Winbond 功能描述:2.5V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
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W25Q80BLSSIP 制造商:WINBOND 制造商全称:Winbond 功能描述:2.5V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI