- 您现在的位置：买卖IC网 > PDF目录141426 > W25Q80BLDAIG (WINBOND ELECTRONICS CORP) 8M X 1 SPI BUS SERIAL EEPROM, PDIP8 PDF资料下载
参数资料
| 型号： | W25Q80BLDAIG |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | PROM |
| 英文描述： | 8M X 1 SPI BUS SERIAL EEPROM, PDIP8 |
| 封装： | 0.300 INCH, GREEN, PLASTIC, DIP-8 |
| 文件页数： | 73/75页 |
| 文件大小： | 2267K |
| 代理商： | W25Q80BLDAIG |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页当前第73页第74页第75页
W25Q80BL
Publication Release Date: July 08, 2010
- 75 -
Preliminary - Revision C
13. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
03/26/09
New Create Preliminary
B
08/20/09
5-8, 45 & 46,
65-71
53
Removed SOIC-16 package
Added PDIP-8 package
Updated package diagrams
Updated Suspend/Resume description
Corrected UID waveform
C
07/08/10
50, 54
63, 66
68-71
5, 9, 20, 55-57
Updated 90h & 9Fh waveforms
Updated parameter VIL/VIH, tSE, tPP
Updated package diagrams
Added SFDP feature
Preliminary Designation
The “Preliminary” designation on a Winbond datasheet indicates that the product is not fully
characterized. The specifications are subject to change and are not guaranteed. Winbond or an
authorized sales representative should be consulted for current information before using this product.
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended
for applications wherein failure of Winbond products could result or lead to a situation wherein personal
injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
相关PDF资料 |
PDF描述 |
|---|---|
| WF1024K32A-100HSM | 4M X 8 FLASH 12V PROM MODULE, 100 ns, CHIP66 |
| WS27C210L-17CMB | 64K X 16 UVPROM, 170 ns, CQCC44 |
| WPS512K8B-25RJM | 512K X 8 STANDARD SRAM, 25 ns, PDSO36 |
| WMF2M8-120FLM5A | 2M X 8 FLASH 5V PROM, 120 ns, CDFP44 |
| WMS128K8C-85CCEA | 128K X 8 STANDARD SRAM, 85 ns, CDIP32 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q80BLDAIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:2.5V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q80BLSNIG | 制造商:Winbond Electronics Corp 功能描述:MEMORY IC |
| W25Q80BLSNIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:2.5V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q80BLSSIG | 制造商:WINBOND 制造商全称:Winbond 功能描述:2.5V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q80BLSSIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:2.5V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
发布紧急采购，3分钟左右您将得到回复。