- 您现在的位置：买卖IC网 > PDF目录276907 > W25X20BVZPIG (WINBOND ELECTRONICS CORP) 2M X 1 FLASH 2.7V PROM, PDSO8 PDF资料下载
参数资料
| 型号： | W25X20BVZPIG |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | PROM |
| 英文描述： | 2M X 1 FLASH 2.7V PROM, PDSO8 |
| 封装： | 6 X 5 MM, GREEN, WSON-8 |
| 文件页数： | 24/51页 |
| 文件大小： | 1632K |
| 代理商： | W25X20BVZPIG |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页当前第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页
W25X10BV/20BV/40BV
- 30 -
9.2.18
Power-down (B9h)
Although the standby current during normal operation is relatively low, standby current can be further
reduced with the Power-down instruction. The lower power consumption makes the Power-down
instruction especially useful for battery powered applications (See ICC1 and ICC2 in AC
Characteristics). The instruction is initiated by driving the /CS pin low and shifting the instruction code
“B9h” as shown in figure 18.
The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Power-
down instruction will not be executed. After /CS is driven high, the power-down state will entered
within the time duration of tDP (See AC Characteristics). While in the power-down state only the
Release from Power-down / Device ID instruction, which restores the device to normal operation, will
be recognized. All other instructions are ignored. This includes the Read Status Register instruction,
which is always available during normal operation. Ignoring all but one instruction makes the Power
Down state a useful condition for securing maximum write protection. The device always powers-up in
the normal operation with the standby current of ICC1.
Figure 18. Deep Power-down Instruction Sequence Diagram
相关PDF资料 |
PDF描述 |
|---|---|
| W7NCF04GH11CS4BG | 256M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC |
| W7NCF04GH11CS4EG | 256M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC |
| W7NCF04GH11CS7FG | 256M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC |
| W7NCF04GH11CS9CG | 256M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC |
| W7NCF08GH11CS3AG | 512M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W25X20CLSNIG | 功能描述:IC FLASH SPI 2MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:256K (32K x 8) 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:28-TSSOP（0.465"，11.8mm 宽） 供应商设备封装:28-TSOP 包装:带卷 (TR) 其它名称:71V256SA15PZGI8 |
| W25X20CLSNIG TR | 制造商:Winbond Electronics Corp 功能描述:IC FLASH 2MBIT 50MHZ 8SOIC |
| W25X20CLUXIG | 制造商:Winbond Electronics Corp 功能描述: |
| W25X20CLZPIG | 功能描述:IC FLASH SPI 2MBIT 8WSON RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?（单线） 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MSOP 包装:带卷 (TR) |
| W25X20CLZPIG TR | 制造商:Winbond Electronics Corp 功能描述:IC FLASH 2MBIT 50MHZ 8WSON |
发布紧急采购，3分钟左右您将得到回复。