- 您现在的位置：买卖IC网 > PDF目录203632 > W72M64V-100BI (MICROSEMI CORP-PMG MICROELECTRONICS) 2M X 64 FLASH 3.3V PROM MODULE, 100 ns, PBGA159 PDF资料下载
参数资料
| 型号： | W72M64V-100BI |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | PROM |
| 英文描述： | 2M X 64 FLASH 3.3V PROM MODULE, 100 ns, PBGA159 |
| 封装： | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 |
| 文件页数： | 11/15页 |
| 文件大小： | 160K |
| 代理商： | W72M64V-100BI |
5
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
W72M64V-XBX
Parameter
Symbol
-100
-120
-150
Unit
Min
Max
Min
Max
Min
Max
Write Cycle Time
tAVAV
tWC
100
120
150
ns
Chip Select Setup Time
tELWL
tCS
00
0
ns
Write Enable Pulse Width
tWLWH
t WP
50
65
ns
Address Setup Time
tAVWL
tAS
00
0
ns
Data Setup Time
tDVWH
tDS
50
65
ns
Data Hold Time
tWHDX
tDH
00
0
ns
Address Hold Time
tWLAX
tAH
50
65
ns
Write Enable Pulse Width High
tWHWL
tWPH
30
35
ns
Duration of Byte Programming Operation (1)
tWHWH1
300
s
Sector Erase (2)
tWHWH2
15
sec
Read Recovery Time before Write (3)
tGHWL
00
0
ns
VCC Setup Time
tVCS
50
s
Chip Programming Time (4)
108
sec
Address Setup Time to OE low during toggle bit polling
t ASO
15
n s
Address Hold Time From CS or OE high
during toggle
t AHT
00
0
n s
Output Enable High during toggle bit polling
t OEPH
20
n s
Latency Between Read and Write Operations
t SR / W
00
0
n s
Write Recovery Time from RY/BY
t RB
00
0
n s
Program/Erase Valid to RY/BY
t BUSY
90
n s
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS - WE CONTROLLED
(VCC = 3.3V ± 0.3V, TA = -55°C to +125°C)
1.
Typical value for tWHWH1 is 7s.
2.
Typical value for tWHWH2 is 0.7 sec.
3.
Guaranteed by design, but not tested.
4.
Typical value is 36 sec. The typical chip programming time is considerably less than the maximum chip programming time listed, since most
bytes program faster than the maximum program times listed.
AC CHARACTERISTICS – READ-ONLY OPERATIONS
(VCC = 3.3V ± 0.3V, TA = -55°C to +125°C)
Parameter
Symbol
-100
-120
-150
Unit
Min
Max Min
Max
Read Cycle Time
tAVAV
tRC
100
120
150
ns
Address Access Time
tAVQV
tACC
100
120
150
ns
Chip Select Access Time
tELQV
tCE
100
120
150
ns
Output Enable to Output Valid
tGLQV
tOE
40
50
55
ns
Chip Select High to Output High Z (1)
tEHQZ
tDF
20
ns
Output Enable High to Output High Z (1)
tGHQZ
tDF
20
ns
Output Hold from Addresses, CS or OE Change,
tAXQX
tOH
00
0
ns
Whichever occurs first
Read
tOEH
00
0
Output Enable Hold Time (1)
Toggle and
Data Polling
10
1.
Guaranteed by design, not tested.
相关PDF资料 |
PDF描述 |
|---|---|
| W72M64VK100BI | 2M X 64 FLASH 3.3V PROM MODULE, 100 ns, PBGA159 |
| W78M64110SBM | 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159 |
| W78M64110SBI | 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159 |
| W78M64120SBI | 8M X 64 FLASH 3.3V PROM, 120 ns, PBGA159 |
| W78M64110SBC | 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W72M64VB-90BI | 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VB-90BM | 制造商:White Electronic Designs 功能描述:Flash Module Parallel 128Mbit 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VK100BC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
发布紧急采购，3分钟左右您将得到回复。