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参数资料
| 型号： | W72M64V-100BI |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | PROM |
| 英文描述： | 2M X 64 FLASH 3.3V PROM MODULE, 100 ns, PBGA159 |
| 封装： | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 |
| 文件页数： | 5/15页 |
| 文件大小： | 160K |
| 代理商： | W72M64V-100BI |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
W72M64V-XBX
FIG 14: ALTERNATE CS CONTROLLED WRITE (ERASE/PROGRAM)
OPERATION TIMINGS
NOTES:
1. Figure indicates last two bus cycles of a program or erase operation.
2. PA = program address, SA = sector address, PD = program data.
3. DQ7 is the complement of the data written to the device. DOUT is the data written to the device.
Addresses
555 for Program
2AA for Erase
PA
tWC
WE
OE
CS
Data
tAS
tAH
tCPH
tWS
DQ7
RESET
tDH
tDS
PD for Program
30 for Sector Erase
10 for Chip Erase
PA for Program
SA for Sector Erase
555 for Chip Erase
Data Polling
tWH
tGHEL
tWHWH1 OR 2
tBUSY
tHR
A0 for Program
55 for Erase
RY/BY
tCP
DOUT
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W72M64VB-90BI | 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VB-90BM | 制造商:White Electronic Designs 功能描述:Flash Module Parallel 128Mbit 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VK100BC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
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