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参数资料
| 型号： | W72M64V-100BI |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | PROM |
| 英文描述： | 2M X 64 FLASH 3.3V PROM MODULE, 100 ns, PBGA159 |
| 封装： | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 |
| 文件页数： | 6/15页 |
| 文件大小： | 160K |
| 代理商： | W72M64V-100BI |
14
White Electronic Designs Corporation Phoenix AZ (602) 437-1520
W72M64V-XBX
W 7 2M64 V XXX B X
ORDERING INFORMATION
PACKAGE: 159 PBGA
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES.
BOTTOM VIEW
13.1 (0.516) MAX
11.43 (0.450) NOM
1.27 (0.050) NOM
1.27
(0.050)
NOM
19.05
(0.750)
NOM
22.1
(0.870)
MAX
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
10
9
8
7
6
5
4
3
2
1
159 Y
0.762 (0.030) NOM
2.03 (0.080) MAX
0.61 (0.024)
NOM
WHITE ELECTRONIC DESIGNS CORP.
Flash
ORGANIZATION, 2M x 64
User configurable as 2 x 2M x 32
3.3V Power supply
ACCESS TIME (ns)
100 = 100ns
120 = 120ns
150 = 150ns
PACKAGETYPE:
B = 159 Plastic BGA, 13mm x 22mm
DEVICE GRADE:
M = Military Screened
-55°C to +125°C
I
= Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
相关PDF资料 |
PDF描述 |
|---|---|
| W72M64VK100BI | 2M X 64 FLASH 3.3V PROM MODULE, 100 ns, PBGA159 |
| W78M64110SBM | 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159 |
| W78M64110SBI | 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159 |
| W78M64120SBI | 8M X 64 FLASH 3.3V PROM, 120 ns, PBGA159 |
| W78M64110SBC | 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W72M64VB-90BI | 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VB-90BM | 制造商:White Electronic Designs 功能描述:Flash Module Parallel 128Mbit 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VK100BC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
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