参数资料
型号: W72M64V-100BI
厂商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分类: PROM
英文描述: 2M X 64 FLASH 3.3V PROM MODULE, 100 ns, PBGA159
封装: 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
文件页数: 15/15页
文件大小: 160K
代理商: W72M64V-100BI
9
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
W72M64V-XBX
FIG 8: CHIP/SECTOR ERASE OPERATION TIMINGS
Notes:
1.
SA = Sector Address (for Sector Erase), VA = Valid Address for reading status data
FIG 7: ACCELERATED PROGRAM TIMING DIAGRAM
VHH
tVHH
VIL or VIH
WP/ACC
VIL or VIH
Addresses
CS
OE
WE
Data
RY/BY
VCC
2AAh
SA
VA
tWC
tAH
tWHWH2
30h
In
Progress
Complete
55h
tBUSY
VA
tAS
tCH
tWP
tCS
tWPH
tDS
tDH
tVCS
tRB
10 for Chip Erase
555h for
chip erase
相关PDF资料
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W72M64VK100BI 2M X 64 FLASH 3.3V PROM MODULE, 100 ns, PBGA159
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