参数资料
型号: W72M64V-100BI
厂商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分类: PROM
英文描述: 2M X 64 FLASH 3.3V PROM MODULE, 100 ns, PBGA159
封装: 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
文件页数: 7/15页
文件大小: 160K
代理商: W72M64V-100BI
15
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
W72M64V-XBX
Document Title
2M x 64 Simultaneous Operation Flash Multi-Chip Package
Revision History
Rev #
History
Release Date
Status
Rev 0
Initial Release
November 2002
Advanced
Rev 1
Update (pg 1, 14, 15)
November 2003
Preliminary
1.1 Change status to preliminary
1.2 Change mechanical drawing to new style
相关PDF资料
PDF描述
W72M64VK100BI 2M X 64 FLASH 3.3V PROM MODULE, 100 ns, PBGA159
W78M64110SBM 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159
W78M64110SBI 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159
W78M64120SBI 8M X 64 FLASH 3.3V PROM, 120 ns, PBGA159
W78M64110SBC 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159
相关代理商/技术参数
参数描述
W72M64VB-90BI 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk
W72M64VB-90BM 制造商:White Electronic Designs 功能描述:Flash Module Parallel 128Mbit 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk
W72M64VK100BC 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package
W72M64VK100BI 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package
W72M64VK100BM 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package