参数资料
型号: W947D6HBHX6E
厂商: WINBOND ELECTRONICS CORP
元件分类: DRAM
英文描述: 8M X 16 DDR DRAM, 5 ns, PBGA60
封装: 8 X 9 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-60
文件页数: 54/60页
文件大小: 1160K
代理商: W947D6HBHX6E
W947D6HB / W947D2HB
128Mb Mobile LPDDR
Publication Release Date:Jun,17, 2011
- 58 -
Revision A01-003
10. ORDERING INFORMATION
W 9 4 7 D 6 H B H X 5 I
Mobile LPDDR/LPSDR SDRAM Package Part Numbering
Product Line
98:mobile LPSDR SDRAM
94:mobile LPDDR SDRAM
Density
7:27=128M 8:28=256M
9:29=512M
Power Supply
D:1.8/1.8 VDD / VDDQ
I/O Ports width
6:16bit
2:32bit
Temperature
with standard Idd6
G:-25C~85C
Package Material
X: Lead-free + Halogen-free
Package or KGD
K: KGD
B: BGA
Package configuration code
G: 54VFBGA, 8mmx9mm
H: 60VFBGA, 8mmx9mm
J: 90VFBGA, 8mmx13mm
Generation
Design revision.
with low power Idd6
E:-25C~85C
I:-40C~85C
Clock rate
5:5ns200MHz
6:6ns166MHz
7:7.5ns133MHz
Part number
VDD/VDDQ I/O width Package
Others
W947D6HBHX5I
1.8V/1.8V
16
60VFBGA 200MHz, -40C~85C, Low power
W947D6HBHX5E
1.8V/1.8V
16
60VFBGA 200MHz, -25C~85C, Low power
W947D6HBHX6E
1.8V/1.8V
16
60VFBGA 166MHz, -25C~85C, Low power
W947D6HBHX6G
1.8V/1.8V
16
60VFBGA 166MHz, -25C~85C
W947D2HBJX5I
1.8V/1.8V
32
90VFBGA 200MHz, -40C~85C, Low power
W947D2HBJX5E
1.8V/1.8V
32
90VFBGA 200MHz, -25C~85C, Low power
W947D2HBJX6E
1.8V/1.8V
32
90VFBGA 166MHz, -25C~85C, Low power
W947D2HBJX6G
1.8V/1.8V
32
90VFBGA 166MHz, -25C~85C
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相关代理商/技术参数
参数描述
W947D6HBHX6G 制造商:WINBOND 制造商全称:Winbond 功能描述:128Mb Mobile LPDDR
W948D2FB 制造商:WINBOND 制造商全称:Winbond 功能描述:256Mb Mobile LPDDR
W948D2FBJX5E 功能描述:IC LPDDR SDRAM 256MBIT 90VFBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:4G(256M x 16) 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:0°C ~ 70°C 封装/外壳:48-TFSOP(0.724",18.40mm 宽) 供应商设备封装:48-TSOP I 包装:Digi-Reel® 其它名称:557-1461-6
W948D2FBJX5ETR 制造商:Winbond Electronics Corp 功能描述:256M MDDR, X32, 200MHZ
W948D2FBJX5I 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR SDRAM 256M-Bit 8Mx32 1.8V 90-Pin VFBGA 制造商:Winbond Electronics Corp 功能描述:IC MEMORY