参数资料
型号: W9864G6EB-7
厂商: WINBOND ELECTRONICS CORP
元件分类: DRAM
英文描述: 4M X 16 SYNCHRONOUS DRAM, 5.5 ns, PBGA60
封装: 0.65 MM PITCH, ROHS COMPLIANT, VFBGA-60
文件页数: 10/47页
文件大小: 1136K
代理商: W9864G6EB-7
W986416EB/W9864G6EB
- 18 -
(1) Tch is the pulse width of CLK measured from the positive edge to the negative edge referenced to VIH
(min.).
Tcl is the pulse width of CLK measured from the negative edge to the positive edge referenced to VIL
(max.).
(2) A.C Latency Characteristics
CKE to clock disable (CKE Latency)
1
Tck
DQM to output to HI-Z (Read DQM Latency)
2
DQM to output to HI-Z (Write DQM Latency)
0
Write command to input data (Write Data Latency)
0
CS to Command input ( CS Latency)
0
CL = 2
2
Precharge to DQ Hi-Z Lead time
CL = 3
3
CL = 2
1
Precharge to Last Valid data out
CL = 3
2
CL = 2
2
Bust Stop Command to DQ Hi-Z Lead time
CL = 3
3
CL = 2
1
Bust Stop Command to Last Valid Data out
CL = 3
2
CL = 2
BL + Trp
Tck+ Ns
Read with Auto-precharge Command to
Active/Ref Command
CL = 3
BL + Trp
Tck+ Ns
CL = 2
(BL+1) + Trp
Tck+ Ns
Write with Auto-precharge Command to Active/Ref
Command
CL = 3
(BL+1) + Trp
Tck+ Ns
相关PDF资料
PDF描述
WE128K8200CQ 128K X 8 EEPROM 5V MODULE, 200 ns, CDIP32
WED9LC6816V1512BI SPECIALTY MEMORY CIRCUIT, PBGA153
WS128K32-35G2TMEA 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68
WS128K32-55G2TIE 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68
WS128K32-35G2TIE 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68
相关代理商/技术参数
参数描述
W9864G6GH 制造商:WINBOND 制造商全称:Winbond 功能描述:1M 】 4 BANKS 】 16 BITS SDRAM
W9864G6GH-5 制造商:WINBOND 制造商全称:Winbond 功能描述:1M 】 4 BANKS 】 16 BITS SDRAM
W9864G6GH-6 制造商:Winbond Electronics Corp 功能描述:4*16BIT SDRAM
W9864G6GH-6I 制造商:WINBOND 制造商全称:Winbond 功能描述:1M 】 4 BANKS 】 16 BITS SDRAM
W9864G6GH-7 制造商:Winbond Electronics Corp 功能描述:64M 3.3V SDRAM 4M X 16