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参数资料
| 型号： | XC2S50-5FGG256C |
| 厂商： | Xilinx Inc |
| 文件页数： | 26/99页 |
| 文件大小： | 0K |
| 描述： | IC SPARTAN-II FPGA 50K 256-FBGA |
| 标准包装： | 90 |
| 系列： | Spartan®-II |
| LAB/CLB数： | 384 |
| 逻辑元件/单元数： | 1728 |
| RAM 位总计： | 32768 |
| 输入/输出数： | 176 |
| 门数： | 50000 |
| 电源电压： | 2.375 V ~ 2.625 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 256-BGA |
| 供应商设备封装： | 256-FBGA（17x17） |
| 产品目录页面： | 599 (CN2011-ZH PDF) |
| 其它名称： | 122-1319 |
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Spartan-II FPGA Family: Functional Description
DS001-2 (v2.8) June 13, 2008
Module 2 of 4
Product Specification
32
R
Using Block RAM Features
The Spartan-II FPGA family provides dedicated blocks of
on-chip, true dual-read/write port synchronous RAM, with
4096 memory cells. Each port of the block RAM memory
can be independently configured as a read/write port, a
read port, a write port, and can be configured to a specific
data width. The block RAM memory offers new capabilities
allowing the FPGA designer to simplify designs.
Operating Modes
Block RAM memory supports two operating modes.
Read Through
Write Back
Read Through (One Clock Edge)
The read address is registered on the read port clock edge
and data appears on the output after the RAM access time.
Some memories may place the latch/register at the outputs
depending on the desire to have a faster clock-to-out versus
setup time. This is generally considered to be an inferior
solution since it changes the read operation to an
asynchronous function with the possibility of missing an
address/control line transition during the generation of the
read pulse clock.
Write Back (One Clock Edge)
The write address is registered on the write port clock edge
and the data input is written to the memory and mirrored on
the write port input.
Block RAM Characteristics
1.
All inputs are registered with the port clock and have a
setup to clock timing specification.
2.
All outputs have a read through or write back function
depending on the state of the port WE pin. The outputs
relative to the port clock are available after the
clock-to-out timing specification.
3.
The block RAM are true SRAM memories and do not
have a combinatorial path from the address to the
output. The LUT cells in the CLBs are still available with
this function.
4.
The ports are completely independent from each other
(i.e., clocking, control, address, read/write function, and
data width) without arbitration.
5.
A write operation requires only one clock edge.
6.
A read operation requires only one clock edge.
The output ports are latched with a self timed circuit to
guarantee a glitch free read. The state of the output port will
not change until the port executes another read or write
operation.
Library Primitives
RAM primitives. Table 11 describes all of the available
primitives for synthesis and simulation.
Figure 31: Dual-Port Block RAM Memory
Figure 32: Single-Port Block RAM Memory
Table 11: Available Library Primitives
Primitive
Port A Width
Port B Width
RAMB4_S1
RAMB4_S1_S1
RAMB4_S1_S2
RAMB4_S1_S4
RAMB4_S1_S8
RAMB4_S1_S16
1N/A
1
2
4
8
16
RAMB4_S2
RAMB4_S2_S2
RAMB4_S2_S4
RAMB4_S2_S8
RAMB4_S2_S16
2N/A
2
4
8
16
WEB
ENB
RSTB
CLKB
ADDRB[#:0]
DIB[#:0]
WEA
ENA
RSTA
CLKA
ADDRA[#:0]
DIA[#:0]
DOA[#:0]
DOB[#:0]
RAMB4_S#_S#
DS001_31_061200
DS001_32_061200
DO[#:0]
WE
EN
RST
CLK
ADDR[#:0]
DI[#:0]
RAMB4_S#
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相关代理商/技术参数 |
参数描述 |
|---|---|
| XC2S50-5FGG256I | 制造商:Xilinx 功能描述:FPGA SPARTAN-II 50K GATES 1728 CELLS 263MHZ 2.5V 256FBGA - Trays |
| XC2S50-5FGG456C | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-II FPGA Family |
| XC2S50-5FGG456I | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-II FPGA Family |
| XC2S50-5PQ208C | 功能描述:IC FPGA 2.5V 384 CLB'S 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-II 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC2S50-5PQ208I | 功能描述:IC FPGA 2.5V I-TEMP 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-II 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
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