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参数资料
| 型号： | XC2S50-5FGG256C |
| 厂商： | Xilinx Inc |
| 文件页数： | 38/99页 |
| 文件大小： | 0K |
| 描述： | IC SPARTAN-II FPGA 50K 256-FBGA |
| 标准包装： | 90 |
| 系列： | Spartan®-II |
| LAB/CLB数： | 384 |
| 逻辑元件/单元数： | 1728 |
| RAM 位总计： | 32768 |
| 输入/输出数： | 176 |
| 门数： | 50000 |
| 电源电压： | 2.375 V ~ 2.625 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 256-BGA |
| 供应商设备封装： | 256-FBGA（17x17） |
| 产品目录页面： | 599 (CN2011-ZH PDF) |
| 其它名称： | 122-1319 |
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Spartan-II FPGA Family: Functional Description
DS001-2 (v2.8) June 13, 2008
Module 2 of 4
Product Specification
43
R
ground metallization. The IC internal ground level deviates
from the external system ground level for a short duration (a
few nanoseconds) after multiple outputs change state
simultaneously.
Ground bounce affects stable Low outputs and all inputs
because they interpret the incoming signal by comparing it
to the internal ground. If the ground bounce amplitude
exceeds the actual instantaneous noise margin, then a
non-changing input can be interpreted as a short pulse with
a polarity opposite to the ground bounce.
Table 18 provides the guidelines for the maximum number
of simultaneously switching outputs allowed per output
power/ground pair to avoid the effects of ground bounce.
Refer to Table 19 for the number of effective output
power/ground pairs for each Spartan-II device and package
combination.
Termination Examples
Creating a design with the Versatile I/O features requires
the instantiation of the desired library primitive within the
design code. At the board level, designers need to know the
termination techniques required for each I/O standard.
This section describes some common application examples
illustrating the termination techniques recommended by
each of the standards supported by the Versatile I/O
features. For a full range of accepted values for the DC
voltage specifications for each standard, refer to the table
associated with each figure.
The resistors used in each termination technique example
and the transmission lines depicted represent board level
components and are not meant to represent components
on the device.
Table 18: Maximum Number of Simultaneously
Switching Outputs per Power/Ground Pair
Package
Standard
CS, FG
PQ,
TQ, VQ
LVTTL Slow Slew Rate, 2 mA drive
68
36
LVTTL Slow Slew Rate, 4 mA drive
41
20
LVTTL Slow Slew Rate, 6 mA drive
29
15
LVTTL Slow Slew Rate, 8 mA drive
22
12
LVTTL Slow Slew Rate, 12 mA drive
17
9
LVTTL Slow Slew Rate, 16 mA drive
14
7
LVTTL Slow Slew Rate, 24 mA drive
9
5
LVTTL Fast Slew Rate, 2 mA drive
40
21
LVTTL Fast Slew Rate, 4 mA drive
24
12
LVTTL Fast Slew Rate, 6 mA drive
17
9
LVTTL Fast Slew Rate, 8 mA drive
13
7
LVTTL Fast Slew Rate, 12 mA drive
10
5
LVTTL Fast Slew Rate, 16 mA drive
8
4
LVTTL Fast Slew Rate, 24 mA drive
5
3
LVCMOS2
10
5
PCI
8
4
GTL
4
GTL+
4
HSTL Class I
18
9
HSTL Class III
9
5
HSTL Class IV
5
3
SSTL2 Class I
15
8
SSTL2 Class II
10
5
SSTL3 Class I
11
6
SSTL3 Class II
7
4
CTT
14
7
AGP
9
5
Notes:
1.
This analysis assumes a 35 pF load for each output.
Table 19: Effective Output Power/Ground Pairs for
Spartan-II Devices
Pkg.
XC2S
15
XC2S
30
XC2S
50
XC2S
100
XC2S
150
XC2S
200
VQ100
8
-
---
CS144
12
-
TQ144
12
-
PQ208
-
16
FG256
-
16
FG456
-
48
Table 18: Maximum Number of Simultaneously
Switching Outputs per Power/Ground Pair
Package
Standard
CS, FG
PQ,
TQ, VQ
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相关代理商/技术参数 |
参数描述 |
|---|---|
| XC2S50-5FGG256I | 制造商:Xilinx 功能描述:FPGA SPARTAN-II 50K GATES 1728 CELLS 263MHZ 2.5V 256FBGA - Trays |
| XC2S50-5FGG456C | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-II FPGA Family |
| XC2S50-5FGG456I | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-II FPGA Family |
| XC2S50-5PQ208C | 功能描述:IC FPGA 2.5V 384 CLB'S 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-II 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC2S50-5PQ208I | 功能描述:IC FPGA 2.5V I-TEMP 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-II 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
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