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型号： XC6SLX25T-2FG484I
厂商： Xilinx Inc
文件页数： 86/89页
文件大小： 0K
描述： IC FPGA SPARTAN 6 484FGGBGA
标准包装： 60
系列： Spartan® 6 LXT
LAB/CLB数： 1879
逻辑元件/单元数： 24051
RAM 位总计： 958464
输入/输出数： 250
电源电压： 1.14 V ~ 1.26 V
安装类型： 表面贴装
工作温度： -40°C ~ 100°C
封装/外壳： 484-BBGA
供应商设备封装： 484-FBGA
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.0) October 17, 2011
www.xilinx.com
Product Specification
87
01/10/11
1.11
Production release of XC6SLX4 and XC6SLX9 in the specific speed grades listed in Table 26 and
Table 27 using ISE v12.4 software with speed specification v1.15 for the -4, -3, -3N, and -2 speed
grades. Added note 3 to Table 27. Also updated the -1L speed grade requirements to ISE v12.4
software with speed specification v1.06. Revised -3N definition throughout the document.
Added note 4 to Table 2 and updated note 5. Added information on VCCINT to note 1 in Table 5.
Updated Networking Applications -3 values in Table 25 to match improvements made in ISE v12.4. In
Table 28, added note 1 and revised the TIOTP values for LVDS_33, LVDS_25, MINI_LVDS_33,
MINI_LVDS_25, RSDS_33, RSDS_25, TMDS_33. PPDS_33, and PPDS_25. Added note 3 to
Table 55.
02/11/11
1.12
As described in XCN11008: Product Discontinuation Notice For Spartan-6 LXT -4 Devices, the -4
speed specifications have been discontinued. As outlined in page 2 of the XCN, designers currently
using -4 speed specifications should rerun timing analysis using the new -3 speed specifications before
moving to a replacement device.
Updated the networking applications section of Table 25. Updated -2 speed specifications throughout
document and added note 3 to Table 27 advising designers to use the -2 speed specification update
(v1.17) with the ISE 12.4 software patch. Added FCLKDIV to Table 37 and Table 38. Updated note 2 in
Table 39. Updated units for TSMCKCSO and TBPICCO in Table 47. Updated -1L in Table 71. Removed
Note 2: Package delay information is available for these device/package combinations. This
information can be used to deskew the package from Table 79.
03/31/11
2.0
Production release of XC6SLX45 in the -1L speed grades listed in Table 26 and Table 27 using ISE
v13.1 software with -1L speed specification v1.06.
In Table 39, removed values in the -1L column and added note 3 as IODELAY2 only supports Tap0 for
lower-power devices. Updated copyright page 1 and Notice of Disclaimer.
05/20/11
2.1
Production release of XC6SLX100 and XC6SLX150 in the specific speed grades listed in Table 26 and
Table 27 using ISE v13.1 software with -1L speed specification v1.06. Updated Table 27 and Note 7
with changes per XCN11012: Speed File Change for -3N Devices. Revised Switching Characteristics
section for speed specifications: v1.18 for -3, -3N, and -2; including improvements in Table 73 through
Table 77 and Table 81.
Removed Memory Controller Block from the performance heading in Table 2 and revised Note 2. In
Table 4, added Note 1 to CIN and updated the description of RIN_TERM. Updated Note 1 in Table 5.
Updated Note 1 of Table 7. In Table 25, added and removed -1L specifications, increased the standard
performance DDR3 specifications, removed the extended performance DDR3 row and updated Note 3
and Note 4. Clarified the introductory information for Table 28 and Table 30.
In Table 32: Revised VMEAS value for LVCMOS12; revised VREF for LVDS_25, LVDS_33,
BLVDS_25,MINI_LVDS_25, MINI_LVDS_33, RSDS_25, and RSDS_33; revised RREF for BLVDS_25
and TMDS_33; and added Note 4 and Note 5. Updated Note 2 and Note 3 in Table 39.
In Table 47, revised the values and description of TPOR including adding Note 3. Also in Table 47,
augmented the description and added specifications for FRBCCK and removed XC6SLX4 from FMCCK
(maximum frequency, parallel mode (Master SelectMAP/BPI). Added BUFGMUX to Table 48 title.
Added Table 50.
In Table 52, revised specifications for TEXTFDVAR and FINJITTER. In Table 54 removed the 5 MHz <
CLKIN_FREQ_DLL parameter in the LOCK_DLL description. In both Table 56 and Table 57, removed
the 5 MHz < FCLKIN parameter in the LOCK_FX description. In Table 58, updated description for
PSCLK_FREQ and PSCLK_PULSE.
Revised title and symbol of Table 70, added new speed specifications for -1L, and added Note 2.
Added Table 71.
07/11/11
2.2
Added the Automotive XA Spartan-6 and Defense-grade Spartan-6Q devices to all appropriate tables
while sometimes removing the XC6S nomenclature. Added expanded temperature range (Q) to all
appropriate tables. Updated TSOL packages in Table 1. Added ROUT_TERM to Table 4. Updated Note 2
on Table 13.
Production release of the XC6SLX4, XC6SLX9, XC6SLX16, XC6SLX25, XC6SLX75, XQ6SLX75, and
XQ6SLX150 in Table 26 and Table 27 using ISE v13.2 software with -1L speed specification v1.07.
Production release of the XA6SLX16, XA6SLX25T, XA6SLX45, XA6SLX45T, XQ6SLX75,
XQ6SLX75T, XQ6SLX150, and XQ6SLX150T in Table 26 and Table 27 using ISE v13.2 software with
-2 and -3 speed specification v1.19.
Added Table 29: IOB Switching Characteristics for the Automotive XA Spartan-6 and the Spartan-6Q
Devices(1). Updated CS(G)484 from CSG484 throughout data sheet. Clarified Note 3 in Table 39.
08/08/11
2.3
Production release of the XA6SLX25, XA6SLX75, and XA6SLX75T in Table 26 and Table 27 using ISE
v13.2 software with -2 and -3 speed specification v1.19.
Date
Version
Description of Revisions
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相关代理商/技术参数
参数描述
XC6SLX25T-2FGG484C 功能描述:IC FPGA SPARTAN 6 24K 484FGGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LXT 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP（28x28）
XC6SLX25T-2FGG484I 功能描述:IC FPGA SPARTAN 6 24K 484FGGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LXT 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
XC6SLX25T-3CSG324C 功能描述:IC FPGA SPARTAN 6 24K 324CSGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LXT 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
XC6SLX25T-3CSG324I 功能描述:IC FPGA SPARTAN 6 24K 324CSGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 6 LXT 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
XC6SLX25T-3FG484C 制造商:Xilinx 功能描述:FPGA SPARTAN?-6 FAMILY 24051 CELLS 45NM (CMOS) TECHNOLOGY 1. - Trays 制造商:Xilinx 功能描述:IC FPGA SPARTAN 6 25K 484BGA 制造商:Xilinx 功能描述:IC FPGA 250 I/O 484FBGA
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