参数资料
型号: XCV812E-8FG900C
厂商: Xilinx Inc
文件页数: 21/118页
文件大小: 0K
描述: IC FPGA 1.8V C-TEMP 900-FBGA
产品变化通告: FPGA Family Discontinuation 18/Apr/2011
标准包装: 1
系列: Virtex®-E EM
LAB/CLB数: 4704
逻辑元件/单元数: 21168
RAM 位总计: 1146880
输入/输出数: 556
门数: 254016
电源电压: 1.71 V ~ 1.89 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 900-BBGA
供应商设备封装: 900-FBGA
Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays
DS025-4 (v3.0) March 21, 2014
Module 4 of 4
41
R
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
Virtex-E Extended Memory Device/Package Combinations and Maximum I/O
Virtex-E Ordering Information
Virtex-II ordering information is shown in Figure 1
Virtex-E Extended Memory Series Maximum User I/O by Device/Package (Excluding Dedicated Clock Pins)
Package
XCV405E
XCV812E
BG560
404
FG676
404
FG900
556
Figure 1: Virtex Ordering Information
Example: XCV405E-6BG560C
Device Type
Temperature Range
C = Commercial (TJ = 0C to +85C)
I = Industrial (TJ = 40C to +100C)
Number of Pins
Package Type
BG = Ball Grid Array
FG = Fine Pitch Ball Grid Array
Speed Grade
(-6, -7, -8)
DS025_001_112000
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XCV812E-8FG900I 制造商:XILINX 制造商全称:XILINX 功能描述:Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays
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