参数资料
| 型号： | XRT75R03DIV-F |
| 厂商： | Exar Corporation |
| 文件页数： | 16/135页 |
| 文件大小： | 0K |
| 描述： | IC LIU E3/DS3/STS-1 3CH 128LQFP |
| 标准包装： | 72 |
| 类型： | 线路接口装置（LIU） |
| 驱动器/接收器数： | 3/3 |
| 规程： | DS3，E3，STS-1 |
| 电源电压： | 3.135 V ~ 3.465 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 128-LQFP |
| 供应商设备封装： | 128-LQFP（14x20） |
| 包装： | 托盘 |
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XRT75R03D
108
THREE CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT WITH SONET DESYNCRONIZER
REV. 1.0.4
b.
The "Transmitting" Network Equipment will notify the remote terminal of this byte-stuffing event, by invert-
ing certain bits within the "pointer word" (within the H1 and H2 bytes) that are referred to as "I" bits.
Figure 46
presents an illustration of the bit-format within the 16-bit word (consist of the H1 and H2 bytes) with
the "I" bits designated.
NOTE: At this time the "I" bits are inverted in order to denote that an "incrementing" pointer adjustment event is currently
occurring.
During the STS-1 frame that follows the "Byte-Stuffing" event
The "I" bits (within the "pointer-word") will be set back to their normal value; and the contents of the H1 and H2
bytes will be incremented by "1".
If f1 > f2
If frequency f1 is greater than f2, then this means that the STS-1 data is being clocked into the "Slip Buffer" at
a faster rate than is being clocked out. In this case, the "Slip Buffer" will start to fill up. Whenever this occurs,
a typical strategy is to delete (e.g., negative-stuff) a byte from the Slip Buffer. The purpose of this "negative-
stuffing" is to compensate for the frequency differences between f1 and f2; and to attempt to keep the "Slip
Buffer" at a somewhat constant fill-level.
NOTE: This byte, which is being "un-stuffed" does carry valuable information for the user (e.g., this byte is typically a
payload byte). Therefore, whenever this negative stuffing occurs, two things must happen.
a.
The "negative-stuffed" byte must not be simply discarded. In other words, it must somehow also be
transmitted to the remote PTE with the remainder of the SPE data.
b.
The remote PTE must be notified of the occurrence of these "negative-stuffing" events. Further, the
remote PTE must know where to obtain this "negative-stuffed" byte.
Negative-Stuffing and Pointer-Decrementing in a SONET Network
Whenever this "byte negative-stuffing" occurs then the following other things occur within the STS-1 data-
stream.
During the STS-1 frame that contains the "Negative Byte-Stuffing" Event
a.
The "Negative-Stuffed" byte will be inserted into the H3 byte position. Whenever an SPE data byte is
inserted into the H3 byte position (which is ordinarily an unused byte), the number of bytes that will exist
between the H3 byte and the J1 byte within the very next SPE will be reduced by 1 byte.
As a
consequence, in this case, the J1 byte (and in-turn, the rest of the SPE) will now be "byte-shifted"
towards the H3 byte position.
FIGURE 46. AN ILLUSTRATION OF THE BIT FORMAT WITHIN THE 16-BIT WORD (CONSISTING OF THE H1 AND H2
BYTES
) WITH THE "I" BITS DESIGNATED
D
I
D
I
D
I
D
I
D
I
S
N
LSB
MSB
H2 Byte
H1 Byte
10 Bit Pointer Expression
相关PDF资料 |
PDF描述 |
|---|---|
| XRT75R03IV-F | IC LIU E3/DS3/STS-1 3CH 128LQFP |
| XRT75R06DIB-F | IC LIU E3/DS3/STS-1 6CH 217BGA |
| XRT75R06IB-F | IC LIU E3/DS3/STS-1 6CH 217BGA |
| XRT75R12DIB-L | IC LIU E3/DS3/STS-1 12CH 420TBGA |
| XRT75R12IB-L | IC LIU E3/DS3/STS-1 12CH 420TBGA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XRT75R03DIVTR | 功能描述:时钟合成器/抖动清除器 3CHNNEL E3/DS3/STS 1 JITTER ATTENUATOR RoHS:否 制造商:Skyworks Solutions, Inc. 输出端数量: 输出电平: 最大输出频率: 输入电平: 最大输入频率:6.1 GHz 电源电压-最大:3.3 V 电源电压-最小:2.7 V 封装 / 箱体:TSSOP-28 封装:Reel |
| XRT75R03DIVTR-F | 功能描述:接口 - 专用 RoHS:否 制造商:Texas Instruments 产品类型:1080p60 Image Sensor Receiver 工作电源电压:1.8 V 电源电流:89 mA 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:BGA-59 |
| XRT75R03ES | 功能描述:时钟合成器/抖动清除器 3CH T3/E3/STS1LIU+JA 3.3V W/REDUNDANCY RoHS:否 制造商:Skyworks Solutions, Inc. 输出端数量: 输出电平: 最大输出频率: 输入电平: 最大输入频率:6.1 GHz 电源电压-最大:3.3 V 电源电压-最小:2.7 V 封装 / 箱体:TSSOP-28 封装:Reel |
| XRT75R03IV | 功能描述:外围驱动器与原件 - PCI 3CHNNEL E3/DS3/STS 1 JITTER ATTENUATOR RoHS:否 制造商:PLX Technology 工作电源电压: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:FCBGA-1156 封装:Tray |
| XRT75R03IV-F | 功能描述:外围驱动器与原件 - PCI 3-Ch E3/DS3/STS-1 RoHS:否 制造商:PLX Technology 工作电源电压: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:FCBGA-1156 封装:Tray |
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