参数资料
型号: ZXM66P03N8TA
厂商: Diodes Inc
文件页数: 2/4页
文件大小: 0K
描述: MOSFET P-CH 30V 7.9A 8-SOIC
产品目录绘图: SO-8
其它图纸: SO-8 Single Pin Out
标准包装: 1
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 6.25A
开态Rds(最大)@ Id, Vgs @ 25° C: 25 毫欧 @ 5.6A,10V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 36nC @ 5V
输入电容 (Ciss) @ Vds: 1979pF @ 25V
功率 - 最大: 1.56W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 标准包装
产品目录页面: 1473 (CN2011-ZH PDF)
其它名称: ZXM66P03N8DKR
ZXM66P03N8
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Drain-Source Voltage
Gate- Source Voltage
Continuous Drain Current V GS =-10V; T A =25°C(b)
V GS =-10V; T A =70°C(b)
V GS =-10V; T A =25°C(a)
Pulsed Drain Current (c)
Continuous Source Current (Body Diode)(b)
Pulsed Source Current (Body Diode)(c)
Power Dissipation at T A =25°C (a)
Linear Derating Factor
Power Dissipation at T A =25°C (b)
Linear Derating Factor
Operating and Storage Temperature Range
SYMBOL
V DSS
V GS
ID
I DM
IS
I SM
PD
PD
T j :T stg
LIMIT
-30
± 20
-7.9
-6.3
-6.25
-28
-4.1
-28
1.56
12.5
2.5
20
-55 to +150
UNIT
V
V
A
A
A
A
W
mW/°C
W
mW/°C
°C
THERMAL RESISTANCE
PARAMETER
Junction to Ambient (a)
Junction to Ambient (b)
SYMBOL
R θ JA
R θ JA
VALUE
80
50
UNIT
°C/W
°C/W
NOTES
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions
(b) For a device surface mounted on FR4 PCB measured at t 10 secs.
(c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05, pulse width 10 s - pulse width limited by maximum junction temperature.
ISSUE 1 - JANUARY 2006
SEMICONDUCTORS
2
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