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| 型号： | 4450HG/3-K |
| 厂商： | EXAR CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | MICROPROCESSOR, PBGA324 |
| 封装： | ROHS COMPLIANT, HSBGA-324 |
| 文件页数： | 88/92页 |
| 文件大小： | 780K |
| 代理商： | 4450HG/3-K |
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4450 – Data Sheet, DS-0131-06
Page 89
Hifn Confidential
Update 8.
Section 8.1 AC Operating Conditions, Table 33: changed tolerance for core
supply voltage (vddi, vdda_pll) to 3%; tolerance for vdde, vddh and vddn
to 5%; removed 2.5V for DDR1 for vddr and changed tolerance to 5%;
added vdds specs.
Update 9.
Section 8.2 PLL Ref Intf Clock Timing, Table 34 125MHz PLL_REF Clock:
changed PLL lock time. Table 34 25MHz PLL_REF Clock: changed PLL lock
time.
Update 10. Section 8.3 RMII Timing: new timing diagram and table.
Update 11. Section 8.4 GMII Timing(Host Intf): new table.
Update 12. Section 8.5 TBI Timing(Host Intf): new table.
Update 13. Section 8.6 RTBI Timing: added content to this section.
Update 14. Section 8.7 RGMII Timing: added content to this section.
Update 15. Section 8.8 SGMII Timing: added content to this section.
Update 16. Section 8.9 SerDes Timing: added content to this section.
Update 17. Section 8.10 SDRAM Timing: modified text to reflect DDR2 SDRAM only.
Update 18. Section 9.1 Pin Lists: undated to reflect pinout changes.
I.4
Document Revision D
Update 1.
Section 6.2.2 GMAC RGMII/RTBI Interface Usage (Host/Network) separated
into Section 6.2.2 GMAC RGMII/RTBI Interface Usage (Host) and 6.2.2 GMAC
RGMII/RTBI Interface Usage (Network) to correct signal name error.
Update 2.
Section 6.4 DDR2 SDRAM Interface: updated description for pins sdclk_fb_i
and sdclk_fb_o.
I.5
Document Revision E
Update 1.
Section 6.4.1 SDRAM Connection Diagrams: removed the 39-ohm series
terms on the data signals.
Update 2.
Section 7.2 Package Thermal Specs: added data for 4 and 8 layer PCB
boards.
Update 3.
Section 7.3 Recommended Operating Conditions: added Table 32 Operating
temp derating factor.
Update 4.
Section 7.4 DC Characteristics Table 35 GPIO Interface: removed low and
high level input current specification. Added low and high level output
current. Table 33 GMAC Interface: removed low and high level input current
specification.
Update 5.
Chapter 8 Timing: updated timing parameters for the DRAM, GMII, TBI,
RGMII, RTBI, and RMII interfaces.
I.6
Document Revision 00
Update 1.
Changed SA support from 250 to 200. Removed support for MACsec.
Update 2.
Section 1 Integrated Public-Key Processing: changed number of supported
public key modules to 4096 from 8192, changed number of small packets
to 550K per second.
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| 45-21/LK2C-B56702C4CB2/2T | SINGLE COLOR LED, COOL WHITE |
| 45-21/LK2C-B38452C4CB2/2T | SINGLE COLOR LED, WARM WHITE |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 445-0X | 制造商:APEX 功能描述:TOOLS, HEX BITS; Bit Type:Slotted; Hex Bit Size:3F-4R; Length:25mm; Size:1" ;RoHS Compliant: NA |
| 4451 | 功能描述:电缆固定件和配件 PG 7 HYBRID CG .87X.59 .12-.28 RoHS:否 制造商:Heyco 类型:Cable Grips, Liquid Tight 材料:Nylon 颜色:Black 安装方法:Cable 最大光束直径:11.4 mm 抗拉强度: |
| 44510 | 功能描述:钳子和镊子 ESD Safe Tweezers 7a SA - 120mm RoHS:否 制造商:OK Industries 大小: 类型:Insertion/Extraction Tools And Kit |
| 44-510 | 制造商:RAWLPLUG 功能描述:RAWLBOLT PROJECTING M625P |
| 445100170 | 制造商:OMRON AUTOMATION AND SAFETY 功能描述:SR10 24VAC/DC OR 110/220VAC |
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