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参数资料
型号： 532802B02500G
厂商： Aavid Thermalloy
文件页数： 37/116页
文件大小： 0K
描述： BOARD LEVEL HEAT SINK
产品培训模块： How to Select a Heat Sink
标准包装： 250
类型： 插件板级，垂直
冷却式包装： TO-220
固定方法： 螺栓固定和 PC 引脚
形状： 矩形
长度： 2.461"（63.50mm）
宽： 1.650"（41.91mm）
机座外的高度（散热片高度）： 1.000"（25.40mm）
温升时的功耗： 6W @ 30°C
在强制气流下的热敏电阻： 在 200 LFM 时为2.0°C/W
自然环境下的热电阻： 4.2°C/W
材质： 铝
材料表面处理： 黑色阳极化处理
其它名称： 041701
27
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
7025
Channel style heat sink with folded back fins
Channel style heat sink with folded
back fins for increased cooling surface
area. Available with tin plated solder-
able tabs for easy attachment to the
printed circuit card.
24.13
(0.950)
26.67
(1.050)
48.26
(1.900)
28.03
(1.104)
2.02
(0.080)
28.70
(1.130)
23.62
(0.930)
3.81
(0.150)
THRU
14.48
(0.570)
5.08
(0.200)
2.54
(0.100)
4.45
(0.175)
19.05
(0.750)
3.18
(0.125)
2.29
(0.090)
TAB
Part Number
Description
7025BG
Channel heat sink with no solderable tabs
7025B-MTG
With solderable mounting tabs
2.90 ( 0.114)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
5
0
20
40
60
80
100
02
4
6
8
10
4
3
1
2
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
ORDERING INFORMATION
25.40
(1.000)
14.48
(0.570)
3.81
(0.150)
THRU
38.23
(1.505)
39.37
(1.550)
2.28
(0.090)
5.08
(0.200)
2.03
(0.080)
9.52
(0.375)
4.83
(0.190)
3.18
(0.125)
11.94
(0.470)
TAB
Part Number
Description
Finish
7019BG
Channel heat sink with no solderable tabs Black anodize
7019PBG
Channel heat sink with no solderable tabs Pre black anodize*
7019B-MTG
With solderable tabs
Black anodize
2.90 ( 0.114)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Narrow channel style heat sink with
folded back fins for increased cooling
surface area. Available with tin plated
solderable tabs for easy attachment to
the printed circuit card.
7019
Narrow channel style heat sink with folded back fins
7020
Narrow channel style heat sink with folded back fins
Narrow channel style heat sink with
folded back fins for increased cooling
surface area. Available with tin plated
solderable tabs for easy attachment to
the printed circuit card.
(0.700)
17.78
(0.470)
11.94
(1.450)
36.83
(1.300)
33.02
(0.570)
14.48
(0.310)
7.87
(1.255)
31.88
(0.240)
6.10
2x
(0.150)
3.81
(0.190)
4.83
(0.125)
3.18
(0.080)
2.02
CL
"x"
TAB
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Part Number
Description
7020BG
Narrow channel heat sink with no solderable tabs
7020B-MTG
With solderable tabs
2.90 (0.114)
ORDERING INFORMATION
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Material: 1.02 (0.040) Thick Aluminum
Finish: See Table
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Position
Code
Description
Location
Details
A
TC10-MT
Insulating device mounting clip
Hole X
Page 93, 98
and solderable tabs
Dia of PCB
Plated Thru
Hole for Tabs
Dia of PCB
Plated Thru
Hole for Tabs
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
POPULAR OPTIONS:
Base part no.
A
7020B-
G
For additional options see page 85
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
相关PDF资料
PDF描述
533522B02552G BOARD LEVEL HEAT SINK
542502D00000G BOARD LEVEL HEAT SINK
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5591S 210 MM X 300 MM 2.5 MM THERM PAD 5591S 210X300MM 2.5MM
5592 210 MM X 300 MM 2.0 MM THERM PAD 5592 210X300MM 2.0MM
相关代理商/技术参数
参数描述
532803-2 功能描述:高速/模块连接器 SS JACKSCREW PASSIVATED RoHS:否 制造商:Molex 系列:iPass 产品类型: 排数: 列数: 位置/触点数量:38 安装角:Right 节距:0.8 mm 安装风格:Plug 端接类型:SMD/SMT 外壳材料:Thermoplastic 触点材料:High Performance Alloy (HPA) 触点电镀:Gold
532805-1 功能描述:高速/模块连接器 HDI JACKSCREW KIT RoHS:否 制造商:Molex 系列:iPass 产品类型: 排数: 列数: 位置/触点数量:38 安装角:Right 节距:0.8 mm 安装风格:Plug 端接类型:SMD/SMT 外壳材料:Thermoplastic 触点材料:High Performance Alloy (HPA) 触点电镀:Gold
5328053 制造商:TE CONNECTIVITY 功能描述:
532805-3 功能描述:HDI JACKSCREW KIT RoHS:否 类别:连接器，互连式 >> Hard Metric，背板，支架和面板 - 配件 系列:- 标准包装:50 系列:8237 附件类型:后壳 适用于相关产品:8457 系列 技术规格:塑料，96 位置 包装:散装
532807-000 制造商:TE Connectivity 功能描述:5024A1661-9
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