参数资料
型号: 70T3399S133BCGI8
厂商: INTEGRATED DEVICE TECHNOLOGY INC
元件分类: SRAM
英文描述: 128K X 18 DUAL-PORT SRAM, 15 ns, PBGA256
封装: 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256
文件页数: 6/28页
文件大小: 327K
代理商: 70T3399S133BCGI8
6.42
IDT70T3339/19/99S
High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
14
Timing Waveform of a Multi-Device Pipelined Read(1,2)
NOTES:
1. B1 Represents Device #1; B2 Represents Device #2. Each Device consists of one IDT70T3339/19/99 for this waveform,
and are setup for depth expansion in this example. ADDRESS(B1) = ADDRESS(B2) in this situation.
2.
UB, LB, OE, and ADS = VIL; CE1(B1), CE1(B2), R/W, CNTEN, and REPEAT = VIH.
Timing Waveform of a Multi-Device Flow-Through Read(1,2)
,
tSC
tHC
CE0(B1)
ADDRESS(B1)
A0
A1
A2
A3
A4
A5
tSA
tHA
CLK
Q0
Q1
Q3
DATAOUT(B1)
tCH2
tCL2
tCYC2
ADDRESS(B2)
A0
A1
A2
A3
A4
A5
tSA
tHA
CE0(B2)
DATAOUT(B2)
Q2
Q4
tCD2
tCKHZ
tCD2
tCKLZ
tDC
tCKHZ
tCD2
tCKLZ
tSC
tHC
tCKHZ
tCKLZ
tCD2
A6
tDC
tSC
tHC
tSC
tHC
5652 drw 07
tSC
tHC
CE0(B1)
ADDRESS(B1)
A0
A1
A2
A3
A4
A5
tSA
tH
A
CLK
5652 drw 08
D0
D3
tCD1
tCKLZ
tCKHZ
(1)
D1
DATAOUT(B1)
tCH1
tCL1
tCYC1
(1)
ADDRESS(B2)
A0
A1
A2
A3
A4
A5
tSA
tHA
CE0(B2)
DATAOUT(B2)
D2
D4
tCD1
tCKHZ
tDC
tCD1
tCKLZ
tSC
tHC
(1)
tCKHZ
(1)
tCKLZ
(1)
tCD1
A6
tDC
tSC
tHC
tSC
tHC
D5
tCD1
tCKLZ
(1)
tCKHZ
(1)
,
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