- 您现在的位置：买卖IC网 > PDF目录222810 > 70T3399S133BCGI8 (INTEGRATED DEVICE TECHNOLOGY INC) 128K X 18 DUAL-PORT SRAM, 15 ns, PBGA256 PDF资料下载
参数资料
| 型号： | 70T3399S133BCGI8 |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | SRAM |
| 英文描述： | 128K X 18 DUAL-PORT SRAM, 15 ns, PBGA256 |
| 封装： | 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 |
| 文件页数： | 9/28页 |
| 文件大小： | 327K |
| 代理商： | 70T3399S133BCGI8 |
第1页第2页第3页第4页第5页第6页第7页第8页当前第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页
6.42
IDT70T3339/19/99S
High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
17
Timing Waveform of Flow-Through Read-to-Write-to-Read (OE = VIL)(2)
TimingWaveform of Flow-ThroughRead-to-Write-to-Read(OEControlled)(2)
NOTES:
1. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals.
2.
CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and REPEAT = VIH.
3. Addresses do not have to be accessed sequentially since
ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for
reference use only.
4. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity.
R/W
ADDRESS
An
An +1
An + 2
An + 3
An + 4
DATAIN
Dn + 2
CE0
CLK
5652 drw 13
Qn
DATAOUT
CE1
UB, LB
tCD1
Qn + 1
tCH1
tCL1
tCYC1
tSD tHD
tCD1
tDC
tCKHZ
Qn + 3
tCD1
tDC
tSC
tHC
tSB
tHB
tSW tHW
tSA
tHA
READ
NOP
READ
tCKLZ
(3)
(1)
tSW tHW
WRITE
(4)
,
R/W
ADDRESS
An
An +1
An + 2
An + 3
An + 4
An + 5
(3)
DATAIN
Dn + 2
CE0
CLK
5652 drw 14
Qn
DATAOUT
CE1
UB, LB
tCD1
tCH1
tCL1
tCYC1
tSD tHD
tCD1
tDC
Qn + 4
tCD1
tDC
tSC
tHC
tSB
tHB
tSW tHW
tSA
tHA
READ
WRITE
READ
tCKLZ
(1)
Dn + 3
tOHZ
tSW tHW
OE
tOE
,
相关PDF资料 |
PDF描述 |
|---|---|
| 70TPS12 | 75 A, 1200 V, SCR, TO-274AA |
| 70TPS16 | 75 A, 1600 V, SCR, TO-274AA |
| 70TPS12PBF | 75 A, 1200 V, SCR, TO-274AA |
| 70TPS16PBF | 75 A, 1600 V, SCR, TO-274AA |
| 70V657S12BFG8 | 32K X 36 DUAL-PORT SRAM, 12 ns, PBGA208 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 70T3399S133BCI | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 2.5V 2M-Bit 128K x 18 15ns/4.2ns 256-Pin CABGA Tray 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 2.5V 2.25MBIT 128KX18 15NS/4.2NS 256BGA - Rail/Tube |
| 70T3399S133BCI8 | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 2.5V 2M-Bit 128K x 18 15ns/4.2ns 256-Pin CABGA T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 2.5V 2.25MBIT 128KX18 15NS/4.2NS 256BGA - Tape and Reel |
| 70T3399S133BF | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 2.5V 2M-Bit 128K x 18 15ns/4.2ns 208-Pin CABGA Tray 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 2.5V 2.25MBIT 128KX18 15NS/4.2NS 208FPBGA - Rail/Tube |
| 70T3399S133BF8 | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 2.5V 2M-Bit 128K x 18 15ns/4.2ns 208-Pin CABGA T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 2.5V 2.25MBIT 128KX18 15NS/4.2NS 208FPBGA - Tape and Reel |
| 70T3399S133BFI | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 2.5V 2M-Bit 128K x 18 15ns/4.2ns 208-Pin CABGA Tray 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 2.5V 2.25MBIT 128KX18 15NS/4.2NS 208FPBGA - Rail/Tube |
发布紧急采购，3分钟左右您将得到回复。