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参数资料
| 型号： | 72V293L6PFG |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | FIFO |
| 英文描述： | 64K X 18 OTHER FIFO, 4 ns, PQFP80 |
| 封装： | GREEN, PLASTIC, TQFP-80 |
| 文件页数： | 39/45页 |
| 文件大小： | 381K |
| 代理商： | 72V293L6PFG |
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44
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72V223/233/243/253/263/273/283/293 3.3V HIGH DENSITY SUPERSYNC IITM NARROW BUS FIFO
512 x 18, 1K x 9/18, 2K x 9/18, 4K x 9/18, 8K x 9/18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9
FEBRUARY 11, 2009
THE INSTRUCTION REGISTER
TheInstructionregisterallowsaninstructiontobeshiftedinseriallyintothe
processor at the rising edge of TCLK.
The Instruction is used to select the test to be performed, or the test data
registertobeaccessed,orboth. Theinstructionshiftedintotheregisterislatched
at the completion of the shifting process when the TAP controller is at Update-
IRstate.
The instruction register must contain 4 bit instruction register-based cells
whichcanholdinstructiondata. Thesemandatorycellsarelocatednearestthe
serial outputs they are the least significant bits.
TEST DATA REGISTER
The Test Data register contains three test data registers: the Bypass, the
Boundary Scan register and Device ID register.
These registers are connected in parallel between a common serial input
and a common serial data output.
The following sections provide a brief description of each element. For a
completedescription,refertotheIEEEStandardTestAccessPortSpecification
(IEEE Std. 1149.1-1990).
TEST BYPASS REGISTER
The register is used to allow test data to flow through the device from TDI
toTDO. Itcontainsasinglestageshiftregisterforaminimumlengthinserialpath.
When the bypass register is selected by an instruction, the shift register stage
is set to a logic zero on the rising edge of TCLK when the TAP controller is in
the Capture-DR state.
The operation of the bypass register should not have any effect on the
operation of the device in response to the BYPASS instruction.
THE BOUNDARY-SCAN REGISTER
The Boundary Scan Register allows serial data TDI be loaded in to or read
out of the processor input/output ports. The Boundary Scan Register is a part
of the IEEE 1149.1-1990 Standard JTAG Implementation.
THE DEVICE IDENTIFICATION REGISTER
The Device Identification Register is a Read Only 32-bit register used to
specify the manufacturer, part number and version of the processor to be
determined through the TAP in response to the IDCODE instruction.
IDT JEDEC ID number is 0xB3. This translates to 0x33 when the parity
is dropped in the 11-bit Manufacturer ID field.
For the IDT72V223/72V233/72V243/72V253/72V263/72V273/72V283/
72V293, the Part Number field contains the following values:
IDT72V223/233/243/253/263/273/283/293JTAGDeviceIdentificationRegister
31(MSB)
28 27
12 11
1 0(LSB)
Version (4 bits)
Part Number (16-bit) Manufacturer ID (11-bit)
0X0
0X33
1
JTAG INSTRUCTION REGISTER
TheInstructionregisterallowsinstructiontobeseriallyinputintothedevice
when the TAP controller is in the Shift-IR state. The instruction is decoded to
perform the following:
Select test data registers that may operate while the instruction is
current. The other test data registers should not interfere with chip
operation and the selected data register.
Definetheserialtestdataregisterpaththatisusedtoshiftdatabetween
TDI and TDO during data register scanning.
The Instruction Register is a 4 bit field (i.e. IR3, IR2, IR1, IR0) to decode
16 different possible instructions. Instructions are decoded as follows.
Hex
Instruction
Function
Value
0x00
EXTEST
Select Boundary Scan Register
0x02
IDCODE
Select Chip Identification data register
0x01
SAMPLE/PRELOAD
Select Boundary Scan Register
0x03
HI-Z
JTAG
0x0F
BYPASS
Select Bypass Register
Table 6. JTAG Instruction Register Decoding
The following sections provide a brief description of each instruction. For
acompletedescriptionrefertotheIEEEStandardTestAccessPortSpecification
(IEEE Std. 1149.1-1990).
EXTEST
The mandatory EXTEST instruction is provided for external circuity and
board level interconnection check.
IDCODE
This instruction is provided to select Device Identification Register to read
out manufacture’s identity, part number and version number.
SAMPLE/PRELOAD
The mandatory SAMPLE/PRELOAD instruction allows data values to be
loadedontothelatchedparalleloutputsoftheboundary-scanshiftregisterprior
to selection of the boundary-scan test instruction. The SAMPLE instruction
allowsasnapshotofdataflowingfromthesystempinstotheon-chiplogicorvice
versa.
HIGH-Z
Thisinstructionplacesalltheoutputpinsonthedeviceintoahighimpedance
state.
BYPASS
The Bypass instruction contains a single shift-register stage and is set to
provide a minimum-length serial path between the TDI and the TDO pins of the
device when no test operation of the device is required.
Device
Part# Field
IDT72V223
04EF
IDT72V233
04EE
IDT72V243
04ED
IDT72V253
04EC
IDT72V263
04EB
IDT72V273
04EA
IDT72V283
04E9
IDT72V293
04E8
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相关代理商/技术参数 |
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| 72V293L7-5BC | 功能描述:先进先出 128Kx9/ 64Kx18 3.3V SUPER SYNC II 先进先出 RoHS:否 制造商:IDT 电路数量: 数据总线宽度:18 bit 总线定向:Unidirectional 存储容量:4 Mbit 定时类型:Synchronous 组织:256 K x 18 最大时钟频率:100 MHz 访问时间:10 ns 电源电压-最大:3.6 V 电源电压-最小:6 V 最大工作电流:35 mA 最大工作温度:+ 85 C 封装 / 箱体:TQFP-80 封装: |
| 72V293L7-5BCI | 功能描述:先进先出 128Kx9/ 64Kx18 3.3V SUPER SYNC II 先进先出 RoHS:否 制造商:IDT 电路数量: 数据总线宽度:18 bit 总线定向:Unidirectional 存储容量:4 Mbit 定时类型:Synchronous 组织:256 K x 18 最大时钟频率:100 MHz 访问时间:10 ns 电源电压-最大:3.6 V 电源电压-最小:6 V 最大工作电流:35 mA 最大工作温度:+ 85 C 封装 / 箱体:TQFP-80 封装: |
| 72V293L7-5PF | 功能描述:先进先出 128Kx9/ 64Kx18 3.3V SUPER SYNC II 先进先出 RoHS:否 制造商:IDT 电路数量: 数据总线宽度:18 bit 总线定向:Unidirectional 存储容量:4 Mbit 定时类型:Synchronous 组织:256 K x 18 最大时钟频率:100 MHz 访问时间:10 ns 电源电压-最大:3.6 V 电源电压-最小:6 V 最大工作电流:35 mA 最大工作温度:+ 85 C 封装 / 箱体:TQFP-80 封装: |
| 72V293L7-5PF8 | 功能描述:先进先出 128Kx9/ 64Kx18 3.3V SUPER SYNC II 先进先出 RoHS:否 制造商:IDT 电路数量: 数据总线宽度:18 bit 总线定向:Unidirectional 存储容量:4 Mbit 定时类型:Synchronous 组织:256 K x 18 最大时钟频率:100 MHz 访问时间:10 ns 电源电压-最大:3.6 V 电源电压-最小:6 V 最大工作电流:35 mA 最大工作温度:+ 85 C 封装 / 箱体:TQFP-80 封装: |
| 72V293L7-5PF9 | 制造商:Integrated Device Technology Inc 功能描述:FIFO Mem Sync Dual Depth/Width Uni-Dir 64K x 18/128K x 9 80-Pin TQFP |
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