参数资料
型号: 73S1217F-EB-LITE
厂商: Maxim Integrated Products
文件页数: 11/93页
文件大小: 0K
描述: BOARD EVAL 73S1217F CBL/DOC/CD
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 1
系列: *
UG_12xxF_016
73S12xxF Software User Guide
Rev. 1.50
19
4
Design Reference
As depicted in Figure 1: Software Architecture Diagram, the 73S12xxF provides many design options for
an application developer. Details of the software modules are described in this section.
4.1
Memory Map
The 73S12xxF contains a high performance, embedded 80515 core, referred to as the ‘core’. It executes
all ASM51 instructions and has the same instruction set as the 80C51.
The core supports separate Program and Data memory as shown in Figure 7. The 73S12xxF family of
devices has two program sizes (32 KB and 64 KB). This program space is segmented into 512-byte
pages. There are 2048 bytes of external data RAM (XData or XRAM) and 256 bytes of internal data
RAM (IData or IRAM).
0000
00
80
FF
0000
FFFF
07FF
0800
SFR
IRAM
upper
IRAM
lower
XRAM
2 K Bytes
FLASH
PROGRAM
MEMORY
64 K Bytes
EXTERNAL
DATA
MEMORY
INTERNAL
DATA
MEMORY
Reserved for
Smart Card,
USB,
Peripheral
Control
Registers
7F
80
FC00
Direct
Addressing
Indirect
Addressing
Direct/Indirect
Adressing
Figure 7: Memory Layout
4.1.1
Program Memory
The 73S12xxF is available with either 64 KB or 32 KB of program memory. The 73S1209F/73S1210F
have 32 KB and the 73S1215F/73S1217F have 64 KB. Contact a Teridian Sales Representative for
ordering information.
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相关代理商/技术参数
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73S1217F-IMR/F 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Bus-Powered 80515 System-on-Chip with USB, ISO 7816 / EMV, PINpad and More
73S13B 制造商:QUARTZCOM 制造商全称:QUARTZCOM the communications company 功能描述:-20 ~ +70 °C commercia l application -30 ~ +75 °C on request
73S5040G01X0A 制造商:NEX Computers 功能描述:INTEL 40GB SSD - Bulk
73S8009C 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Versatile Power Management and Smart Card Interface IC
73S8009C-20IM/F 功能描述:输入/输出控制器接口集成电路 Smart Card Interface IC RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray