- 您现在的位置：买卖IC网 > PDF目录16270 > 73S1217F-EB-LITE (Maxim Integrated Products)BOARD EVAL 73S1217F CBL/DOC/CD PDF资料下载
参数资料
| 型号： | 73S1217F-EB-LITE |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/93页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL 73S1217F CBL/DOC/CD |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 1 |
| 系列： | * |
第1页当前第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页
73S12xxF Software User Guide
UG_12xxF_016
10
Rev. 1.50
2.2.2
API/Library and Header Files
The library files included in the software development kit are listed below (see Figure 1: Software
Architecture Diagram for the library partitions). The following nomenclature applies to the file names:
‘?’ is either ‘S’ (for Single-8010) or ‘M’ (for Multiple-8010)
‘xx’ is ‘BL’ (for Serial Boot Loader), ‘DFU’ for USB DFU Boot Loader or empty.
There are other versions such as LAPI-MS1.LIB, LAPI-SLED.LIB, that are specific builds for specific
hardware setups and are typically NOT included in the sample application project files. For all
evaluation purposes, these files will NOT be used.
The High-level API library does not include a USB API. For the USB 2.0 Specification (specifically,
chapter 9 of the specification), the LAPI layer handles all endpoint 0 (or control endpoint) communications
with the host; thus a High-level API for USB is not necessary. An application can call the LAPI USB
functions directly for all of its bulk and interrupt endpoint communications.
LAPI-?xx.lib1
I2C_SC-?xx.lib
Low-level API library containing control of both internal and external smart
card slots. This library should be included in an application that supports
an I2C interface via an 8010 IC.
Low-level API library containing all necessary core controls.
ICC_API-?xx.lib
High-level Smart Card API library for Smart Card.
In addition, the following header (.h) and source (.c) files are included:
API_12.h
Low-level header file. Include this file in all embedded applications.
Api_struct_12.h
Low-level header file with all enumeration types defined.
Reg12xx.h
Low-level header file specific to the 73S12xxF peripheral registers.
LangIDs.h
Low-level header file. Include this file in all embedded applications for USB
communication.
Portable.h
Low-level header file. Include this file in all embedded applications.
Reg_banks_12.h
Low-level header file. Include this file in all embedded applications.
ICCMgt.h
High-level ICC header file. Include this file when the ICC_API.lib is used.
Allocate.c
High-level API common file that indicates the specific number of commands
that can be used for each High-level API library.
Allocate.h
High-level API common header file used with allocate.c.
Commands.h
High-level API common header file used with allocate.h.
CCID Source
See the CCIDAP_73S12xx_V...pdf file under the CCID USB Firmware
folder.
P-CCID Source
See the 12xxANPseudo-CCID-SerialProtocol…pdf file in the TSC-
12xxRS232\vx.xx\TSCP-CCID\Firmware\Doc folder.
1 When the low-level LAPI-?xx.LIB library is included in an application, the compiler requires that the
modules within the library be exclusively selected; otherwise, it will not be included. No error/warning will
be displayed during the build but when the hex file is downloaded and run, the intended function will not
operate as expected. To avoid this problem, right-click on the low-level LAPI-?xx.LIB library (after adding
it to the project), select ‘options for File LAPI-?xx.LIB’ – and under ‘Select Modules to Always Include’,
select the modules that the application uses, as listed. If program space permits, select all listed
modules. This setup can be optimized later (once the application code is stable) by deselecting unused
modules to reduce code space.
相关PDF资料 |
PDF描述 |
|---|---|
| UPT2D221MHD6 | CAP ALUM 220UF 200V 20% RADIAL |
| MAX5391NEVMINIQU+ | EVAL KIT MAX5391 |
| GSC08DRTN-S93 | CONN EDGECARD 16POS DIP .100 SLD |
| CM453232-R56KL | INDUCTOR 560NH 520MA SMD |
| REC15-1212D/H3 | CONV DC/DC 15W 12VIN +/-12VOUT |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 73S1217F-IMR/F | 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Bus-Powered 80515 System-on-Chip with USB, ISO 7816 / EMV, PINpad and More |
| 73S13B | 制造商:QUARTZCOM 制造商全称:QUARTZCOM the communications company 功能描述:-20 ~ +70 °C commercia l application -30 ~ +75 °C on request |
| 73S5040G01X0A | 制造商:NEX Computers 功能描述:INTEL 40GB SSD - Bulk |
| 73S8009C | 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Versatile Power Management and Smart Card Interface IC |
| 73S8009C-20IM/F | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface IC RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
发布紧急采购，3分钟左右您将得到回复。