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| 型号： | 73S8009R-IM/F |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 15/23页 |
| 文件大小： | 0K |
| 描述： | IC SMART CARD LEVEL SHIFT 20-QFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 490 |
| 应用： | 智能卡读取器，写入器 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-VFQFN 裸露焊盘 |
| 供应商设备封装： | 20-QFN（4x4） |
| 包装： | 管件 |
DS_8009R_056
73S8009R Data Sheet
Choice of the V CC capacitor:
Depending on the application, the requirements in terms of both the V CC minimum voltage and the
transient currents that the interface must be able to provide to the card are different. An external
capacitor must be connected between the VCC pin and the card ground in order to guarantee stability of
the LDO regulator, and to handle the transient requirements. The type and value of this capacitor can be
optimized to meet the desired specification. Table 8 shows the recommended capacitors for each V PC
power supply configuration and applicable specification.
Table 8: Choice of VCC Pin Capacitor
Specification Requirements
System Requirements
Specification
EMV 4.1
ISO-7816-3 &
GSM11.11
Min V CC Voltage
allowed during
transient current
4.6 V
4.5 V
Max Transient
Current Charge
30 nA ? s
20 nA ? s
Min V PC Power
Supply required
4.75 V
4.75 V
Capacitor
Type
X5R/X7R
with
ESR<100 m Ω
Capacitor
Value
3.3 μF
1 μF
3.5
Over-temperature Monitor
A built-in detector monitors die temperature. When an over-temperature condition occurs, a card
deactivation sequence is initiated, and an error or fault condition is reported to the system controller via
the OFF interrupt.
3.6
Activation and Deactivation Sequence
The host controller is fully responsible for the activation sequencing of the smart card signals CLK, RST,
I/O, AUX1 and AUX2. All of these signals are held low when the card is in the deactivated state. Upon
card activation (the fall of CMDVCC#/CMDVCC% , all the signals will remain low until RDY goes high. The
host should set the signals RSTIN, I/OUC, CLKIN, AUX1UC and AUX2UC low prior to activating the card
and allow RDY to go high before transitioning any of these signals. In order to initiate activation, the card
must be present and there can be no over-temperature fault and no V DD fault.
At t1 (500 μ s), if RDY = 0 or overcurrent, circuit will de-activate (safety feature)
CMDVCC3 or CMDVCC5
VCC
IOUC
IO
RDY
RSTIN
RST
CLKIN
Ignored
Ignored
Ignored
t1
VCC valid
IO = IOUC if RDY=1
RST=RSTIN if RDY=1
CLK
CLK=CLKIN if RDY=1
IO, AUX1, AUX2, CLK, RST are held LOW until RDY = 1 and CMDVCCx = 0
Figure 5: Activation Sequence
Rev. 1.3
15
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 73S8009R-IMR/F | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface IC RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8010C | 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Smart Card Interface |
| 73S8010C-DB | 功能描述:界面开发工具 73S8010C Demo Brd RoHS:否 制造商:Bourns 产品:Evaluation Boards 类型:RS-485 工具用于评估:ADM3485E 接口类型:RS-485 工作电源电压:3.3 V |
| 73S8010C-IL/F | 功能描述:I2C 接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| 73S8010C-ILR/F | 功能描述:I2C 接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
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