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参数资料
| 型号： | 73S8009R-IM/F |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 17/23页 |
| 文件大小： | 0K |
| 描述： | IC SMART CARD LEVEL SHIFT 20-QFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 490 |
| 应用： | 智能卡读取器，写入器 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-VFQFN 裸露焊盘 |
| 供应商设备封装： | 20-QFN（4x4） |
| 包装： | 管件 |
DS_8009R_056
PRES
OFF
CMDVCC
VCC
OFF is low by
card extracted
73S8009R Data Sheet
OFF is low by
any fault
outside card session
within card session
within card
session
Figure 7: OFF Activity Outside and Inside a Card Session
3.8
Power-down Operation
A power-down function is provided that disables all analog functions. The power-down state is only
allowed in the de-activated condition. The host invokes the power-down state when it is desirable to save
power.
The signals PRES and PRES are functional in the power-down state so that a card insertion asserts OFF
high. If there is no card present ( OFF = low) in power-down mode, the pull-up resistor is disabled so that
no current is drawn from VDD. If a card is inserted, the pull-up resistor is enabled and OFF goes high.
Upon receiving the OFF indication, the host must then de-assert power down (PWRDN) and wait until the
circuit is ready. When PWRDN is de-asserted, OFF goes low to indicate that the circuit is not ready (it is
going through the power-on recovery time). When the circuit is ready, OFF will go high if the card is
present. Figure 8 illustrates the behavior of the circuit for PWRDN events.
PRES
OFF
PWRDN
OFF will go high if card is present and there are no faults
OFF goes low when PWRDN is de-asserted while circuit starts up
OFF going high indicates
circuit is ready
PWRDN while CMDVCCx=0
has no effect
PWRDN will have effect
when CMDVCCx=1
RC OSC
~30 μ s
Controller must wait for OFF=1 after
setting PWRDN=0 before setting
~30 μ s
CMDVCC3 /
CMDVCC(3/5)=0
CMDVCC5
RDY - indicates VCC is OK
Figure 8: Power-down Operation
Rev. 1.3
17
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 73S8009R-IMR/F | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface IC RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8010C | 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Smart Card Interface |
| 73S8010C-DB | 功能描述:界面开发工具 73S8010C Demo Brd RoHS:否 制造商:Bourns 产品:Evaluation Boards 类型:RS-485 工具用于评估:ADM3485E 接口类型:RS-485 工作电源电压:3.3 V |
| 73S8010C-IL/F | 功能描述:I2C 接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| 73S8010C-ILR/F | 功能描述:I2C 接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
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