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参数资料
| 型号： | 73S8009R-IM/F |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 16/23页 |
| 文件大小： | 0K |
| 描述： | IC SMART CARD LEVEL SHIFT 20-QFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 490 |
| 应用： | 智能卡读取器，写入器 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-VFQFN 裸露焊盘 |
| 供应商设备封装： | 20-QFN（4x4） |
| 包装： | 管件 |
73S8009R Data Sheet
DS_8009R_056
Deactivation is initiated either by the system controller setting CMDVCC#/CMDVCC% high, or
automatically in the event of hardware faults. Hardware faults are over-current, over-temperature and
card extraction during the session. The host can manage the I/O signals, CLKIN, RSTIN, and
CMDVCC#/CMDVCC% to create other de-activation sequences for non-emergency situations.
CMDVCC% or CMDVCC#
VCC
I/OUC
I/O
OFF
RSTIN
RST
CLKIN
CLK
~ 100 μ s
5 - V CC is lowered
4 - I/O falls approx 2 μ s after CLK falls
1 - OFF falls due to card removal or fault
2 - RST forced low approx. 0.6 μ s after OFF falls
3 - CLK forced low approx. 7.5 μ s after RST falls
Note: Host should set STROBE low when OFF goes low, otherwise CLK may be truncated
Figure 6: Deactivation Sequence
3.7
OFF and Fault Detection
The system controller can monitor the OFF signal to:
?
?
Query regarding the card presence outside of a card session
Detect faults during card sessions.
Outside a Card Session
In this condition, CMDVCC#/CMDVCC% ) is always high, OFF is low if the card is not present and high if
the card is present. Because it is outside a card session, any fault detection will not act upon the OFF
signal. No deactivation is required during this time.
During a Card Session
In this condition, CMDVCC#/CMDVCC% is always low and OFF falls low if the card is extracted or if any
fault is detected. At the same time that OFF is set low, the sequencer automatically starts the
deactivation process and the host should stop all transition on the signal lines.
session and outside the card session.
16
Rev. 1.3
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 73S8009R-IMR/F | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface IC RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8010C | 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Smart Card Interface |
| 73S8010C-DB | 功能描述:界面开发工具 73S8010C Demo Brd RoHS:否 制造商:Bourns 产品:Evaluation Boards 类型:RS-485 工具用于评估:ADM3485E 接口类型:RS-485 工作电源电压:3.3 V |
| 73S8010C-IL/F | 功能描述:I2C 接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| 73S8010C-ILR/F | 功能描述:I2C 接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
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