参数资料
| 型号： | AD7793BRU |
| 厂商： | Analog Devices Inc |
| 文件页数： | 21/33页 |
| 文件大小： | 0K |
| 描述： | IC ADC 24BIT 3CH LP 16-TSSOP |
| 设计资源： | Fully Isolated Input Module Based on AD7793 and ADuM5401(CN0066) Fully Isolated Input Module Based on AD7793, ADuM5401, and a High Performance In-Amp (CN0067) |
| 标准包装： | 1 |
| 位数： | 24 |
| 采样率（每秒）： | 500 |
| 数据接口： | DSP，MICROWIRE?，QSPI?，串行，SPI? |
| 转换器数目： | 1 |
| 功率耗散（最大）： | 2.5mW |
| 电压电源： | 模拟和数字 |
| 工作温度： | -40°C ~ 105°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 16-TSSOP |
| 包装： | 管件 |
| 输入数目和类型： | 3 个差分，单极；3 个差分，双极 |
| 配用： | EVAL-AD7793EBZ-ND - BOARD EVALUATION FOR AD7793 |
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AD7792/AD7793
Rev. B | Page 27 of 32
The ground planes of the AD7792/AD7793 should be allowed
to run under the AD7792/AD7793 to prevent noise coupling.
The power supply lines to the AD7792/AD7793 should use as
wide a trace as possible to provide low impedance paths and
reduce the effects of glitches on the power supply line. Fast
switching signals such as clocks should be shielded with digital
ground to avoid radiating noise to other sections of the board,
and clock signals should never be run near the analog inputs.
Avoid crossover of digital and analog signals. Traces on
opposite sides of the board should run at right angles to each
other. This reduces the effects of feedthrough through the
board. A microstrip technique is by far the best, but it is not
always possible with a double-sided board. In this technique,
the component side of the board is dedicated to ground planes,
and signals are placed on the solder side.
Good decoupling is important when using high resolution
ADCs. AVDD should be decoupled with 10 μF tantalum in
parallel with 0.1 μF capacitors to GND. DVDD should be
decoupled with 10 μF tantalum in parallel with 0.1 μF
capacitors to the system’s DGND plane, with the system’s
AGND to DGND connection being close to the
AD7792/AD7793.
To achieve the best from these decoupling components, they
should be placed as close as possible to the device, ideally right
up against the device. All logic chips should be decoupled with
0.1 μF ceramic capacitors to DGND.
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| AD7799BRU | IC ADC 24BIT 3CH LP 16-TSSOP |
| AD7801BRU | IC DAC 8BIT PARALLEL INP 20TSSOP |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AD7793BRU-REEL | 制造商:Analog Devices 功能描述:ADC Single Delta-Sigma 470sps 24-bit Serial 16-Pin TSSOP T/R 制造商:Analog Devices 功能描述:ADC SGL DELTA-SIGMA 0.47KSPS 24BIT SERL 16TSSOP - Tape and Reel |
| AD7793BRUZ | 功能描述:IC ADC 24BIT SIG-DEL 3CH 16TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1 系列:microPOWER™ 位数:8 采样率（每秒）:1M 数据接口:串行，SPI? 转换器数目:1 功率耗散（最大）:- 电压电源:模拟和数字 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:24-VFQFN 裸露焊盘 供应商设备封装:24-VQFN 裸露焊盘（4x4） 包装:Digi-Reel® 输入数目和类型:8 个单端，单极 产品目录页面:892 (CN2011-ZH PDF) 其它名称:296-25851-6 |
| AD7793BRUZ1 | 制造商:AD 制造商全称:Analog Devices 功能描述:3-Channel, Low Noise, Low Power, 16-/24-Bit ?￡-?? ADC with On-Chip In-Amp and Reference |
| AD7793BRUZ-REEL | 功能描述:IC ADC 24BIT 3CH LP 16-TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1,000 系列:- 位数:16 采样率（每秒）:45k 数据接口:串行 转换器数目:2 功率耗散（最大）:315mW 电压电源:模拟和数字 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:28-SOIC（0.295"，7.50mm 宽） 供应商设备封装:28-SOIC W 包装:带卷 (TR) 输入数目和类型:2 个单端，单极 |
| AD7793BRUZ-REEL1 | 制造商:AD 制造商全称:Analog Devices 功能描述:3-Channel, Low Noise, Low Power, 16-/24-Bit ?￡-?? ADC with On-Chip In-Amp and Reference |
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