参数资料
型号: AD9552BCPZ
厂商: Analog Devices Inc
文件页数: 11/32页
文件大小: 0K
描述: IC PLL CLOCK GEN LP 32LFCSP
设计资源: Clock Distribution Circuit with Pin-Programmable Output Frequency, Output Logic Levels, and Fanout (CN0152)
标准包装: 1
类型: 时钟发生器
PLL: 带旁路
输入: CMOS,晶体
输出: CMOS,LVDS,LVPECL
电路数: 1
比率 - 输入:输出: 2:2
差分 - 输入:输出: 无/是
频率 - 最大: 900MHz
除法器/乘法器: 是/无
电源电压: 3.135 V ~ 3.465 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 32-VFQFN 裸露焊盘,CSP
供应商设备封装: 32-LFCSP-VQ(5x5)
包装: 托盘
Data Sheet
AD9552
Rev. E | Page 19 of 32
APPLICATIONS INFORMATION
THERMAL PERFORMANCE
Table 13. Thermal Parameters for the 32-Lead LFCSP Package
Symbol
Thermal Characteristic Using a JEDEC51-7 Plus JEDEC51-5 2S2P Test Board1
Unit
θ
JA
Junction-to-ambient thermal resistance, 0.0 m/sec airflow per JEDEC JESD51-2 (still air)
40.5
°C/W
θ
JMA
Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
35.4
°C/W
θ
JMA
Junction-to-ambient thermal resistance, 2.5 m/sec airflow per JEDEC JESD51-6 (moving air)
31.8
°C/W
θ
JB
Junction-to-board thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-8 (moving air)
23.3
°C/W
θ
JC
Junction-to-case thermal resistance (die-to-heat sink) per MIL-Std 883, Method 1012.1
4.2
°C/W
Ψ
JT
Junction-to-top-of-package characterization parameter, 0 m/sec airflow per JEDEC JESD51-2 (still air)
0.4
°C/W
1 The exposed pad on the bottom of the package must be soldered to ground to achieve the specified thermal performance.
2 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the
application to determine whether they are similar to those assumed in these calculations.
The AD9552 is specified for an ambient temperature (TA). To
ensure that TA is not exceeded, an airflow source can be used.
Use the following equation to determine the junction tempera-
ture on the application PCB:
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by the customer
at the top center of the package.
ΨJT is the value indicated in Table 13.
PD is the power dissipation (see the Specifications section).
Values of θJA are provided for package comparison and PCB design
considerations. θJA can be used for a first-order approximation
of TJ using the following equation:
TJ = TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
Values of θJB are provided for package comparison and PCB
design considerations.
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