参数资料
| 型号： | AD9600ABCPZ-150 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 4/72页 |
| 文件大小： | 0K |
| 描述： | IC ADC 10BIT 150MSPS 64LFCSP |
| 标准包装： | 1 |
| 位数： | 10 |
| 采样率（每秒）： | 150M |
| 数据接口： | 串行，SPI? |
| 转换器数目： | 2 |
| 功率耗散（最大）： | 890mW |
| 电压电源： | 模拟和数字 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 64-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 64-LFCSP-VQ（9x9） |
| 包装： | 托盘 |
| 输入数目和类型： | 4 个单端，单极；2 个差分，单极 |
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AD9600
Rev. B | Page 12 of 72
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
ELECTRICAL
AVDD, DVDD to AGND
0.3 V to +2.0 V
DRVDD to DRGND
0.3 V to +3.9 V
AGND to DRGND
0.3 V to +0.3 V
AVDD to DRVDD
3.9 V to +2.0 V
VIN + A/VIN + B, VIN A/VIN B to
AGND
0.3 V to AVDD + 0.2 V
CLK+, CLK to AGND
0.3 V to +3.9 V
SYNC to AGND
0.3 V to +3.9 V
VREF to AGND
0.3 V to AVDD + 0.2 V
SENSE to AGND
0.3 V to AVDD + 0.2 V
CML to AGND
0.3 V to AVDD + 0.2 V
RBIAS to AGND
0.3 V to AVDD + 0.2 V
CSB to AGND
0.3 V to +3.9 V
SCLK/DFS to DRGND
0.3 V to +3.9 V
SDIO/DCS to DRGND
0.3 V to DRVDD + 0.3 V
SMI SDO/OEB
0.3 V to DRVDD + 0.3 V
SMI SCLK/PDWN
0.3 V to DRVDD + 0.3 V
SMI SDFS
0.3 V to DRVDD + 0.3 V
Output Data Pins to DRGND1
0.3 V to DRVDD + 0.3 V
Fast Detect Output Pins to DRGND2
0.3 V to DRVDD + 0.3 V
Data Clock Output Pins to DRGND3
0.3 V to DRVDD + 0.3 V
ENVIRONMENTAL
Operating Temperature Range
(Ambient)
40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range
(Ambient)
65°C to +150°C
1 The output data pins are D0A/D0B to D9A/D9B for the CMOS configuration
and D0+/D0 to D9+/D9 for the LVDS configuration.
2 The fast detect output pins are FD0A/FD0B to FD3A/FD3B for the CMOS
configuration and FD0+/FD0 to FD3+/FD3.
3 The data clock output pins are DCOA and DCOB for the CMOS configuration
and DCO+ and DCO for the LVDS configuration.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the
customer board increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Table 7. Thermal Resistance
Package Type
Airflow
Velocity
(m/s)
θJB1,4
Unit
64-Lead, 9 mm × 9 mm
LFCSP (CP-64-3,
CP-64-6)
0
18.8
0.6
6.0
°C/W
1.0
16.5
°C/W
2.0
15.8
°C/W
1 Per JEDEC 51-7 standard and JEDEC 25-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per MIL-Std 883, Method 1012.1.
4 Per JEDEC JESD51-8 (still air).
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, metal (such as metal traces through holes, ground,
and power planes) that is in direct contact with the package
leads reduces the θJA.
ESD CAUTION
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