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参数资料
| 型号： | ADP1740ACPZ-1.1-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 17/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 1.1V 2A 16LFCSP |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 1.1V |
| 输入电压： | 1.6 V ~ 3.6 V |
| 稳压器数量： | 1 |
| 电流 - 输出： | 2A（最小值） |
| 电流 - 限制（最小）： | 2.4A |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VQFN 裸露焊盘，CSP |
| 供应商设备封装： | 16-LFCSP-VQ EP（4x4） |
| 包装： | 标准包装 |
| 产品目录页面： | 794 (CN2011-ZH PDF) |
| 其它名称： | ADP1740ACPZ-1.1-R7DKR |
Data Sheet
ADP1740/ADP1741
In cases where the board temperature is known, the thermal
characterization parameter, Ψ JB , can be used to estimate the
junction temperature rise. Maximum junction temperature (T J )
is calculated from the board temperature (T B ) and the power
140
120
100
MAX JUNCTION
TEMPERATURE
dissipation (P D ) using the following formula:
LOAD = 2A
LOAD = 1A
T J = T B + ( P D × Ψ JB )
(7)
80
60
LOAD = 500mA
calculations for different board temperatures, load currents,
V IN to V OUT differentials, and areas of PCB copper.
40
LOAD = 250mA
140
MAX JUNCTION
TEMPERATURE
20
LOAD = 100mA
LOAD = 10mA
120
0
0.25
0.75
1.25
1.75
2.25
2.75
100
LOAD = 2A
LOAD = 1A
V IN – V OUT (V)
Figure 44. 1000 mm 2 of PCB Copper, T B = 25°C, LFCSP
80
60
LOAD = 500mA
140
120
MAX JUNCTION
TEMPERATURE
40
20
LOAD = 250mA
LOAD = 10mA
100
80
LOAD = 2A
LOAD = 1A
LOAD = 500mA
LOAD = 100mA
LOAD = 250mA
0
0.25
0.75
1.25
1.75
2.25
2.75
60
140
V IN – V OUT (V)
Figure 42. 500 mm 2 of PCB Copper, T B = 25°C, LFCSP
MAX JUNCTION
40
20
LOAD = 100mA
LOAD = 10mA
TEMPERATURE
120
0
LOAD = 2A
0.25
0.75
1.25
1.75
2.25
2.75
100
LOAD = 1A
LOAD = 500mA
V IN – V OUT (V)
Figure 45. 1000 mm 2 of PCB Copper, T B = 50°C, LFCSP
80
60
LOAD = 250mA
PCB LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by increasing
40
20
LOAD = 100mA
LOAD = 10mA
the amount of copper attached to the pins of the ADP1740/
ADP1741. However, as shown in Table 6, a point of diminishing
returns is eventually reached, beyond which an increase in the
copper size does not yield significant heat dissipation benefits.
0
0.25
0.75
1.25
1.75
2.25
2.75
Here are a few general tips when designing PCBs:
V IN – V OUT (V)
Figure 43. 500 mm 2 of PCB Copper, T B = 50°C, LFCSP
?
?
?
?
Place the input capacitor as close as possible to the VIN
and GND pins.
Place the output capacitor as close as possible to the VOUT
and GND pins.
Place the soft start capacitor close to the SS pin.
Connect the load as close as possible to the VOUT and
SENSE pins (ADP1740) or to the VOUT and ADJ pins
(ADP1741).
Use of 0603 or 0805 size capacitors and resistors achieves the
smallest possible footprint solution on boards where area is
limited.
Rev. F | Page 17 of 20
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相关代理商/技术参数 |
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| ADP1740ACPZ-2.5-R7 | 功能描述:IC REG LDO 2.5V 2A 16LFCSP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 产品培训模块:MIC5365/66 Ultra-small LDO Regulators 标准包装:1 系列:- 稳压器拓扑结构:正，固定式 输出电压:3V 输入电压:最高 5.5V 电压 - 压降（标准）:0.155V @ 150mA 稳压器数量:1 电流 - 输出:150mA 电流 - 限制（最小）:200mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:4-UDFN 裸露焊盘，4-TMLF? 供应商设备封装:4-TMLF?（1x1） 包装:Digi-Reel® 其它名称:576-3192-6 |
| ADP1740-BL1-EVZ | 制造商:Analog Devices 功能描述:Evaluation Board For Low Dropout Linear Regulator 制造商:Analog Devices 功能描述:BLANK ADISIMPOWER EVAL ADP1740 - Boxed Product (Development Kits) |
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