参数资料
型号: ADP1829ACPZ-R7
厂商: Analog Devices Inc
文件页数: 25/28页
文件大小: 0K
描述: IC REG CTRLR BUCK PWM VM 32LFCSP
标准包装: 1
PWM 型: 电压模式
输出数: 2
频率 - 最大: 720kHz
占空比: 93%
电源电压: 3 V ~ 20 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 125°C
封装/外壳: 32-VFQFN 裸露焊盘,CSP
包装: 标准包装
产品目录页面: 791 (CN2011-ZH PDF)
配用: ADP1829-EVALZ-ND - BOARD EVALUATION ADP1829
其它名称: ADP1829ACPZ-R7DKR

Data Sheet
PCB LAYOUT GUIDELINES
For PCB layout guidelines, refer to the AN-1119 Application
Note , Printed Circuit Board Layout Guidelines for Step-Down
Regulators, Optimizing for Low Noise Design with Dual Channel
Switching Controllers .
LFCSP PACKAGE CONSIDERATIONS
The LFCSP package has an exposed die paddle on the bottom
that efficiently conducts heat to the PCB. The thermal pad of
the LFCSP package provides a low thermal impedance path to
the PCB. Therefore, the PCB must be properly designed to
ADP1829
effectively conduct the heat away from the package. This is
achieved by adding thermal vias to the PCB, which provide a
thermal path to the inner or bottom layers.
Note that the thermal pad is attached to the die substrate, so the
planes that the thermal pad is connected to must be electrically
isolated or connected to GND.
The LFCSP is compliant with JEDECMO220 and MO229
outlines. Refer to the AN-772 Application Note for LFCSP
package design and manufacturing guidelines.
Rev. C | Page 25 of 28
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