参数资料
型号: ADP1874-0.6-EVALZ
厂商: Analog Devices Inc
文件页数: 38/44页
文件大小: 0K
描述: BOARD EVAL FOR ADP1874
标准包装: 1
系列: *
ADP1874/ADP1875
BOTTOM
RESISTOR TAP
TO ANALOG
GROUND PLANE
PGND SENSE TAP FROM
NEGATIVE TERMINALS OF
THE OUTPUT BULK
CAPACITORS. THIS
TRACK PLACEMENT
SHOULD BE DIRECTLY
BELOW THE VOUT SENSE
LINE OF LAYER 3.
Figure 94. Layer 4 (Bottom Layer) of ADP1874 / ADP1875 Evaluation Board
Data Sheet
IC SECTION (LEFT SIDE OF EVALUATION BOARD)
A dedicated plane for the analog ground plane (GND) should
be separate from the main power ground plane (PGND). With
the shortest path possible, connect the analog ground plane to
the GND pin (Pin 5). This plane should be on only the top layer
of the evaluation board. To avoid crosstalk interference, there
should not be any other voltage or current pathway directly below
this plane on Layer 2, Layer 3, or Layer 4. Connect the negative
terminals of all sensitive analog components to the analog ground
plane. Examples of such sensitive analog components include
the resistor divider’s bottom resistor, the high frequency bypass
capacitor for biasing (0.1 μF), and the compensation network.
Mount a 1 μF bypass capacitor directly across the VREG pin
(Pin 7) and the PGND pin (Pin 13). In addition, a 0.1 μF should
be tied across the VREG pin (Pin 7) and the GND pin (Pin 5).
POWER SECTION
As shown in Figure 91, an appropriate configuration to localize
large current transfer from the high voltage input (V IN ) to the
output (V OUT ) and then back to the power ground is to put the
V IN plane on the left, the output plane on the right, and the main
power ground plane in between the two. Current transfers from
the input capacitors to the output capacitors, through Q1/Q2,
during the on state (see Figure 95). The direction of this current
(yellow arrow) is maintained as Q1/Q2 turns off and Q3/Q4 turns
on. When Q3/Q4 turns on, the current direction continues to be
maintained (yellow arrow) as it circles from the bulk capacitor
power ground terminal to the output capacitors, through
Q3/Q4. Arranging the power planes in this manner minimizes
the area in which changes in flux occur if the current through
Q1/Q2 stops abruptly. Sudden changes in flux, usually at the
source terminals of Q1/Q2 and the drain terminal of Q3/Q4,
cause large dv/dt at the SW node.
The SW node is near the top of the evaluation board. The SW
node should use the least amount of area possible and be away
from any sensitive analog circuitry and components. This is
because the SW node is where most sudden changes in flux
density occur. When possible, replicate this pad onto Layer 2
and Layer 3 for thermal relief and eliminate any other voltage and
current pathways directly beneath the SW node plane. Populate
the SW node plane with vias, mainly around the exposed pad of
the inductor terminal and around the perimeter of the source of
Q1/Q2 and the drain of Q3/Q4. The output voltage power plane
(V OUT ) is at the rightmost end of the evaluation board. This plane
should be replicated, descending down to multiple layers with
vias surrounding the inductor terminal and the positive terminals
of the output bulk capacitors. Ensure that the negative terminals of
the output capacitors are placed close to the main power ground
(PGND), as previously mentioned. All of these points form a
tight circle (component geometry permitting) that minimizes
the area of flux change as the event switches between D and 1 ? D.
Figure 95. Primary Current Pathways During the On State of the Upper Side
MOSFET (Left Arrow) and the On State of the Lower Side MOSFET (Right Arrow)
Rev. A | Page 38 of 44
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ADP1874ARQZ-0.6-R7 功能描述:IC REG CTRLR BUCK PWM CM 16-QSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:2,500 系列:- PWM 型:电流模式 输出数:1 频率 - 最大:500kHz 占空比:96% 电源电压:4 V ~ 36 V 降压:无 升压:是 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:无 工作温度:-40°C ~ 125°C 封装/外壳:24-WQFN 裸露焊盘 包装:带卷 (TR)
ADP1874ARQZ-1.0-R7 功能描述:IC REG CTRLR BUCK PWM CM 16-QSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:2,500 系列:- PWM 型:电流模式 输出数:1 频率 - 最大:500kHz 占空比:96% 电源电压:4 V ~ 36 V 降压:无 升压:是 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:无 工作温度:-40°C ~ 125°C 封装/外壳:24-WQFN 裸露焊盘 包装:带卷 (TR)
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