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参数资料
| 型号： | ADSP-BF534YBCZ-4B |
| 厂商： | Analog Devices Inc |
| 文件页数： | 23/68页 |
| 文件大小： | 0K |
| 描述： | IC DSP CTLR 16BIT 400MHZ 208-CSP |
| 产品培训模块： | Blackfin® Processor Core Architecture Overview Blackfin® Device Drivers Blackfin® Optimizations for Performance and Power Consumption Blackfin® System Services |
| 标准包装： | 1 |
| 系列： | Blackfin® |
| 类型： | 定点 |
| 接口： | CAN，SPI，SSP，TWI，UART |
| 时钟速率： | 400MHz |
| 非易失内存： | 外部 |
| 芯片上RAM： | 132kB |
| 电压 - 输入/输出： | 2.50V，3.30V |
| 电压 - 核心： | 1.20V |
| 工作温度： | -40°C ~ 105°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 208-LFBGA，CSPBGA |
| 供应商设备封装： | 208-CSPBGA |
| 包装： | 托盘 |
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Rev. J
|
Page 3 of 68
|
February 2014
GENERAL DESCRIPTION
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors are
members of the Blackfin
family of products, incorporating the
Analog Devices, Inc./Intel Micro Signal Architecture (MSA).
Blackfin processors combine a dual-MAC, state-of-the-art sig-
nal processing engine, the advantages of a clean, orthogonal
RISC-like microprocessor instruction set, and single-instruc-
tion, multiple-data (SIMD) multimedia capabilities into a single
instruction-set architecture.
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors are
completely code and pin compatible. They differ only with
respect to their performance, on-chip memory, and presence of
the Ethernet MAC module. Specific performance, memory, and
feature configurations are shown in Table 1.
By integrating a rich set of industry-leading system peripherals
and memory, the Blackfin processors are the platform of choice
for next-generation applications that require RISC-like pro-
grammability, multimedia support, and leading-edge signal
processing in one integrated package.
PORTABLE LOW POWER ARCHITECTURE
Blackfin processors provide world-class power management
and performance. They are produced with a low power and low
voltage design methodology and feature on-chip dynamic
power management, which is the ability to vary both the voltage
and frequency of operation to significantly lower overall power
consumption. This capability can result in a substantial reduc-
tion in power consumption, compared with just varying the
frequency of operation. This allows longer battery life for
portable appliances.
SYSTEM INTEGRATION
The Blackfin processor is a highly integrated system-on-a-chip
solution for the next generation of embedded network-con-
nected applications. By combining industry-standard interfaces
with a high performance signal processing core, cost-effective
applications can be developed quickly, without the need for
costly external components. The system peripherals include an
IEEE-compliant 802.3 10/100 Ethernet MAC (ADSP-BF536 and
ADSP-BF537 only), a CAN 2.0B controller, a TWI controller,
two UART ports, an SPI port, two serial ports (SPORTs), nine
general-purpose 32-bit timers (eight with PWM capability), a
real-time clock, a watchdog timer, and a parallel peripheral
interface (PPI).
BLACKFIN PROCESSOR PERIPHERALS
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors con-
tain a rich set of peripherals connected to the core via several
high bandwidth buses, providing flexibility in system configura-
tion as well as excellent overall system performance (see
Figure 1). The processors contain dedicated network communi-
cation modules and high speed serial and parallel ports, an
interrupt controller for flexible management of interrupts from
the on-chip peripherals or external sources, and power manage-
ment control functions to tailor the performance and power
characteristics of the processor and system to many application
scenarios.
All of the peripherals, except for the general-purpose I/O, CAN,
TWI, real-time clock, and timers, are supported by a flexible
DMA structure. There are also separate memory DMA channels
dedicated to data transfers between the processor’s various
memory spaces, including external SDRAM and asynchronous
memory. Multiple on-chip buses running at up to 133 MHz
provide enough bandwidth to keep the processor core running
along with activity on all of the on-chip and external
peripherals.
The Blackfin processors include an on-chip voltage regulator in
support of the processors’ dynamic power management capabil-
ity. The voltage regulator provides a range of core voltage levels
when supplied from VDDEXT. The voltage regulator can be
bypassed at the user’s discretion.
Table 1. Processor Comparison
Features
ADSP
-BF534
ADSP
-BF536
ADSP
-BF537
Ethernet MAC
—
1
CAN
1
TWI
1
SPORTs
2
UARTs
2
SPI
1
GP Timers
8
Watchdog Timers
1
RTC
1
Parallel Peripheral Interface
1
GPIOs
48
Memory
Configuration
L1 Instruction
SRAM/Cache
16K bytes
16K bytes 16K bytes
L1 Instruction
SRAM
48K bytes
48K bytes 48K bytes
L1 Data
SRAM/Cache
32K bytes
32K bytes 32K bytes
L1 Data SRAM 32K bytes
—
32K bytes
L1 Scratchpad 4K bytes
4K bytes
L3 Boot ROM
2K bytes
Maximum Speed Grade
500 MHz
400 MHz
600 MHz
Package Options:
CSP_BGA
208-Ball
182-Ball
208-Ball
182-Ball
208-Ball
182-Ball
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| ADSP-BF535PBB-200 | 功能描述:IC DSP CONTROLLER 16BIT 260BGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:Blackfin® 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI，以太网，RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA，FCBGA 供应商设备封装:431-FCPBGA（20x20） 包装:托盘 |
| ADSP-BF535PBB-300 | 功能描述:IC DSP CONTROLLER 16BIT 260BGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:Blackfin® 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI，以太网，RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA，FCBGA 供应商设备封装:431-FCPBGA（20x20） 包装:托盘 |
| ADSP-BF535PBBZ-200 | 功能描述:IC DSP CONTROLLER 16BIT 260-BGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:Blackfin® 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI，以太网，RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA，FCBGA 供应商设备封装:431-FCPBGA（20x20） 包装:托盘 |
| ADSPBF535PKB300 | 制造商:Analog Devices 功能描述: |
| ADSP-BF535PKB-300 | 功能描述:IC DSP CONTROLLER 16BIT 260 BGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:Blackfin® 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI，以太网，RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA，FCBGA 供应商设备封装:431-FCPBGA（20x20） 包装:托盘 |
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