参数资料
型号: ADSP-BF534YBCZ-4B
厂商: Analog Devices Inc
文件页数: 7/68页
文件大小: 0K
描述: IC DSP CTLR 16BIT 400MHZ 208-CSP
产品培训模块: Blackfin® Processor Core Architecture Overview
Blackfin® Device Drivers
Blackfin® Optimizations for Performance and Power Consumption
Blackfin® System Services
标准包装: 1
系列: Blackfin®
类型: 定点
接口: CAN,SPI,SSP,TWI,UART
时钟速率: 400MHz
非易失内存: 外部
芯片上RAM: 132kB
电压 - 输入/输出: 2.50V,3.30V
电压 - 核心: 1.20V
工作温度: -40°C ~ 105°C
安装类型: 表面贴装
封装/外壳: 208-LFBGA,CSPBGA
供应商设备封装: 208-CSPBGA
包装: 托盘
Rev. J
|
Page 15 of 68
|
February 2014
hibernate state, VDDEXT can still be applied, eliminating the need
for external buffers. The voltage regulator can be activated from
this power-down state by asserting the RESET pin, which then
initiates a boot sequence. The regulator can also be disabled and
bypassed at the user’s discretion. For additional information on
voltage regulation, see Switching Regulator Design Consider-
ations for the ADSP-BF533 Blackfin Processors (EE-228).
CLOCK SIGNALS
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors can
be clocked by an external crystal, a sine wave input, or a buff-
ered, shaped clock derived from an external clock oscillator.
If an external clock is used, it should be a TTL compatible signal
and must not be halted, changed, or operated below the speci-
fied frequency during normal operation. This signal is
connected to the processor’s CLKIN pin. When an external
clock is used, the XTAL pin must be left unconnected.
Alternatively, because the processors include an on-chip oscilla-
tor circuit, an external crystal can be used. For fundamental
frequency operation, use the circuit shown in Figure 6. A
parallel-resonant, fundamental frequency, microprocessor-
grade crystal is connected across the CLKIN and XTAL pins.
The on-chip resistance between CLKIN and the XTAL pin is in
the 500 k range. Further parallel resistors are typically not rec-
ommended. The two capacitors and the series resistor shown in
Figure 6 fine-tune phase and amplitude of the sine frequency.
The capacitor and resistor values shown in Figure 6 are typical
values only. The capacitor values are dependent upon the crystal
manufacturers’ load capacitance recommendations and the PCB
physical layout. The resistor value depends on the drive level
specified by the crystal manufacturer. The user should verify the
customized values based on careful investigations of multiple
devices over temperature range.
A third-overtone crystal can be used for frequencies above
25 MHz. The circuit is then modified to ensure crystal operation
only at the third overtone, by adding a tuned inductor circuit as
shown in Figure 6. A design procedure for third-overtone oper-
ation is discussed in detail in the application note Using Third
Overtone Crystals with the ADSP-218x DSP (EE-168).
The CLKBUF pin is an output pin, and is a buffer version of the
input clock. This pin is particularly useful in Ethernet applica-
tions to limit the number of required clock sources in the
system. In this type of application, a single 25 MHz or 50 MHz
crystal can be applied directly to the processors. The 25 MHz or
50 MHz output of CLKBUF can then be connected to an exter-
nal Ethernet MII or RMII PHY device.
Because of the default 10× PLL multiplier, providing a 50 MHz
CLKIN exceeds the recommended operating conditions of the
lower speed grades. Because of this restriction, an RMII PHY
requiring a 50 MHz clock input cannot be clocked directly from
the CLKBUF pin for the lower speed grades. In this case, either
provide a separate 50 MHz clock source, or use an RMII PHY
with 25 MHz clock input options. The CLKBUF output is active
by default and can be disabled using the VR_CTL register for
power savings.
The Blackfin core runs at a different clock rate than the on-chip
peripherals. As shown in Figure 7, the core clock (CCLK) and
system peripheral clock (SCLK) are derived from the input
clock (CLKIN) signal. An on-chip PLL is capable of multiplying
the CLKIN signal by a programmable 0.5× to 64× multiplication
factor (bounded by specified minimum and maximum VCO
frequencies). The default multiplier is 10×, but it can be modi-
fied by a software instruction sequence in the PLL_CTL register.
On-the-fly CCLK and SCLK frequency changes can be effected
by simply writing to the PLL_DIV register. Whereas the maxi-
mum allowed CCLK and SCLK rates depend on the applied
voltages VDDINT and VDDEXT, the VCO is always permitted to run
up to the frequency specified by the part’s speed grade. The
CLKOUT pin reflects the SCLK frequency to the off-chip world.
It belongs to the SDRAM interface, but it functions as a refer-
ence signal in other timing specifications as well. While active
by default, it can be disabled using the EBIU_SDGCTL and
EBIU_AMGCTL registers.
All on-chip peripherals are clocked by the system clock (SCLK).
The system clock frequency is programmable by means of the
SSEL3–0 bits of the PLL_DIV register. The values programmed
into the SSEL fields define a divide ratio between the PLL output
Figure 6. External Crystal Connections
CLKIN
CLKOUT
XTAL
EN
CLKBUF
TO PLL CIRCUITRY
FOR OVERTONE
OPERATION ONLY:
NOTE: VALUES MARKED WITH * MUST BE CUSTOMIZED, DEPENDING
ON THE CRYSTAL AND LAYOUT. PLEASE ANALYZE CAREFULLY.
18 pF *
EN
18 pF *
330
*
BLACKFIN
350
1M
V
DDEXT
Figure 7. Frequency Modification Methods
PLL
0.5 to 64
÷1 to 15
÷1,2, 4, 8
VCO
CLKIN
“FINE” ADJUSTMENT
REQUIRES PLL SEQUENCING
“COARSE” ADJUSTMENT
ON-THE-FLY
CCLK
SCLK
CCLK
SCLK
133 MHz
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