参数资料
型号: AGLE3000V5-FGG484
厂商: Microsemi SoC
文件页数: 67/166页
文件大小: 0K
描述: IC FPGA IGLOOE 1.5V 484FPBGA
标准包装: 60
系列: IGLOOe
逻辑元件/单元数: 75264
RAM 位总计: 516096
输入/输出数: 341
门数: 3000000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 484-BGA
供应商设备封装: 484-FPBGA(23x23)
其它名称: 1100-1118
IGLOOe Low Power Flash FPGAs
Revision 13
5-3
Revision 9
(continued)
The example in the paragraph above Table 2-31 Duration of Short Circuit Event before
Failure was revised to change the maximum temperature from 110°C to 100°C, with an
example of six months instead of three months (SAR 32287).
The notes regarding drive strength in the "Summary of I/O Timing Characteristics –
LVCMOS Wide Range" section tables were revised for clarification. They now state that
the minimum drive strength for the default software configuration when run in wide range
is ±100 A. The drive strength displayed in software is supported in normal range only.
For a detailed I/V curve, refer to the IBIS models (SAR 34766).
The AC Loading figures in the "Single-Ended I/O Characteristics" section were updated
Settings" section (SAR 34886).
The following sentence was deleted from the "2.5 V LVCMOS" section (SAR 34793): "It
uses a 5 V–tolerant input buffer and push-pull output buffer."
Specification were updated. A note was added to both tables indicating that when the
CCC/PLL core is generated by Microsemi core generator software, not all delay values
of the specified delay increments are available (SAR 34818).
The following figures were deleted. Reference was made to a new application note,
FPGAs, which covers these cases in detail (SAR 34869).
Figure 2-46 Write Access after Write onto Same Address
Figure 2-47 Read Access after Write onto Same Address
Figure 2-48 Write Access after Read onto Same Address
The port names in the SRAM "Timing Waveforms", SRAM "Timing Characteristics"
tables, Figure 2-50 FIFO Reset, and the FIFO "Timing Characteristics" tables were
revised to ensure consistency with the software names (SAR 35749).
The "Pin Descriptions and Packaging" chapter is new (SAR 34768).
Package names used in the "Package Pin Assignments" section were revised to match
standards given in Package Mechanical Drawings (SAR 34768)
July 2010
The versioning system for datasheets has been changed. Datasheets are assigned a
revision number that increments each time the datasheet is revised. The "IGLOOe
Device Status" table on page II indicates the status for each device in the device family.
N/A
Revision
Changes
Page
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AGLE3000V5-FGG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
AGLE3000V5-FGG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
AGLE3000V5-FGG896ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
AGLE3000V5-FGG896I 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
AGLE3000V5-FGG896PP 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology