参数资料
型号: AGLE3000V5-FGG484
厂商: Microsemi SoC
文件页数: 72/166页
文件大小: 0K
描述: IC FPGA IGLOOE 1.5V 484FPBGA
标准包装: 60
系列: IGLOOe
逻辑元件/单元数: 75264
RAM 位总计: 516096
输入/输出数: 341
门数: 3000000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 484-BGA
供应商设备封装: 484-FPBGA(23x23)
其它名称: 1100-1118
IGLOOe Low Power Flash FPGAs
Revision 13
5-7
Advance v0.4
(December 2007)
The Table 1 IGLOOe Product Family table was updated to change the maximum
number of user I/Os for AGLE3000.
dimensions were removed from the "I/Os Per Package1" table. The number of
I/Os was updated for FG896.
A note regarding marking information was added to the "IGLOOe Ordering
Table 2-4 IGLOOe CCC/PLL Specification and Table 2-5 IGLOOe CCC/PLL
Specification were updated.
2-18,
2-19
The "During Flash*Freeze Mode" section was updated to include information
about the output of the I/O to the FPGA core
.
2-60
Figure 2-38 Flash*Freeze Mode Type 1 – Timing Diagram was updated to
modify the LSICC signal.
2-56
Table 2-32 Flash*Freeze Pin Location in IGLOOe Family Packages (device-
independent) was updated for the FG896 package.
2-64
Figure 2-40 Flash*Freeze Mode Type 2 – Timing Diagram was updated to
modify the LSICC Signal.
2-58
Information regarding calculation of the quiescent supply current was added to
the "Quiescent Supply Current" section.
3-6
Table 3-8 Quiescent Supply Current (IDD), IGLOOe Flash*Freeze Mode was
updated.
3-6
Table 3-9 Quiescent Supply Current (IDD), IGLOOe Sleep Mode (VCC = 0 V)
was updated.
3-6
Table 3-11 Quiescent Supply Current, No IGLOOe Flash*Freeze Mode1 was
updated.
3-6
Table 3-99 Minimum and Maximum DC Input and Output Levels was updated.
3-51
Table 3-136 JTAG 1532 and Table 3-135 JTAG 1532 were updated.
3-95
The "484-Pin FBGA" table for AGLE3000 is new.
4-11
The "896-Pin FBGA" package and table for AGLE3000 is new.
4-16
Advance v0.3
(September 2007)
Cortex-M1 device information was added to the Table 1 IGLOOe Product Family
Advance v0.2
The words "ambient temperature" were added to the temperature range in the
Grade and Temperature Grade Matrix" sections.
The TJ parameter in Table 3-2 Recommended Operating Conditions was
changed to TA, ambient temperature, and table notes 6–8 were added.
3-2
Revision
Changes
Page
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AGLE3000V5-FGG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
AGLE3000V5-FGG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
AGLE3000V5-FGG896ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
AGLE3000V5-FGG896I 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
AGLE3000V5-FGG896PP 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology